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B57891M0682000 Datasheet(PDF) 19 Page - EPCOS

Part No. B57891M0682000
Description  NTC thermistors for temperature measurement
Download  28 Pages
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Maker  EPCOS [EPCOS]
Homepage  http://www.epcos.com
Logo EPCOS - EPCOS

B57891M0682000 Datasheet(HTML) 19 Page - EPCOS

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Reflow soldering
Recommended temperature characteristic for reflow soldering following JEDEC J-STD-020D
Profile feature
Sn-Pb eutectic assembly
Pb-free assembly
Preheat and soak
- Temperature min
Tsmin
100
°C
150
°C
- Temperature max
Tsmax
150
°C
200
°C
- Time
tsmin to tsmax 60 ... 120 s
60 ... 180 s
Average ramp-up rate
Tsmax to Tp
3
°C/ s max.
3
°C/ s max.
Liquidous temperature
TL
183
°C
217
°C
Time at liquidous
tL
60 ... 150 s
60 ... 150 s
Peak package body temperature
Tp1)
220
°C ... 235 °C2)
245
°C ... 260 °C2)
Time (tP)3) within 5
°C of specified
classification temperature (Tc)
20 s3)
30 s3)
Average ramp-down rate
Tp to Tsmax
6
°C/ s max.
6
°C/ s max.
Time 25
°C to peak temperature
maximum 6 min
maximum 8 min
1) Tolerance for peak profile temperature (TP) is defined as a supplier minimum and a user maximum.
2) Depending on package thickness. For details please refer to JEDEC J-STD-020D.
3) Tolerance for time at peak profile temperature (tP) is defined as a supplier minimum and a user maximum.
Note: All temperatures refer to topside of the package, measured on the package body surface.
Number of reflow cycles: 3
Temperature measurement and compensation
B57891M
Leaded NTC thermistors, lead spacing 2.5 mm
M891
Page 19 of 28
Please read Cautions and warnings and
Important notes at the end of this document.


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