 |
Electronic Components Datasheet Search |
|
|
Electronic Components Datasheet Search |
|
B57891M0682000 Datasheet(PDF) 17 Page - EPCOS |
|
||||||||||||||||||||||||||||||
B57891M0682000 Datasheet(HTML) 17 Page - EPCOS |
|
|
17 / 28 page 
1.3.1 Solderability (test to IEC 60068-2-58) Preconditioning: Immersion into flux F-SW 32. Evaluation criterion: Wetting of soldering areas ≥95%. Solder Bath temperature ( °C) Dwell time (s) SnPb 60/40 215 ±3 3 ±0.3 SnAg (3.0 ... 4.0), Cu (0.5 ... 0.9) 245 ±3 3 ±0.3 1.3.2 Resistance to soldering heat (test to IEC 60068-2-58) Preconditioning: Immersion into flux F-SW 32. Evaluation criterion: Leaching of side edges ≤1/3. Solder Bath temperature ( °C) Dwell time (s) SnPb 60/40 260 ±5 10 ±1 SnAg (3.0 ... 4.0), Cu (0.5 ... 0.9) 260 ±5 10 ±1 Temperature measurement and compensation B57891M Leaded NTC thermistors, lead spacing 2.5 mm M891 Page 17 of 28 Please read Cautions and warnings and Important notes at the end of this document. |
|
English ▼
Chinese
German
Japanese
Russian
Korean
Spanish
French
Italian
Portuguese
Polish
Vietnamese
