Electronic Components Datasheet Search
  English  ▼

Delete All


Preview PDF Download HTML

B57891M0682000 Datasheet(PDF) 16 Page - EPCOS

Part No. B57891M0682000
Description  NTC thermistors for temperature measurement
Download  28 Pages
Scroll/Zoom Zoom In 100% Zoom Out
Homepage  http://www.epcos.com

B57891M0682000 Datasheet(HTML) 16 Page - EPCOS

Back Button B57891M0682000 Datasheet HTML 12Page - EPCOS B57891M0682000 Datasheet HTML 13Page - EPCOS B57891M0682000 Datasheet HTML 14Page - EPCOS B57891M0682000 Datasheet HTML 15Page - EPCOS B57891M0682000 Datasheet HTML 16Page - EPCOS B57891M0682000 Datasheet HTML 17Page - EPCOS B57891M0682000 Datasheet HTML 18Page - EPCOS B57891M0682000 Datasheet HTML 19Page - EPCOS B57891M0682000 Datasheet HTML 20Page - EPCOS Next Button
Zoom Inzoom in Zoom Outzoom out
 16 / 28 page
background image
Mounting instructions
Leaded NTC thermistors
Leaded thermistors comply with the solderability requirements specified by CECC.
When soldering, care must be taken that the NTC thermistors are not damaged by excessive
heat. The following maximum temperatures, maximum time spans and minimum distances have
to be observed:
Dip soldering
Iron soldering
Bath temperature
max. 260
max. 360
Soldering time
max. 4 s
max. 2 s
Distance from thermistor
min. 6 mm
min. 6 mm
Under more severe soldering conditions the resistance may change.
Leadless NTC thermistors
In case of NTC thermistors without leads, soldering is restricted to devices which are provided
with a solderable metallization. The temperature shock caused by the application of hot solder
may produce fine cracks in the ceramic, resulting in changes in resistance.
To prevent leaching of the metallization, solder with silver additives or with a low tin content
should be used. In addition, soldering methods should be employed which permit short soldering
SMD NTC thermistors
SMD NTC thermistors can be provided with a nickel barrier termination or on special request with
silver-palladium termination. The usage of mild, non-activated fluxes for soldering is recommend-
ed as well as a proper cleaning of the PCB.
Nickel barrier termination
The nickel barrier layer of the silver/nickel/tin termination (see figure 1) prevents leaching of the
silver base metalization layer. This allows great flexibility in the selection of soldering parameters.
The tin prevents the nickel layer from oxidizing and thus ensures better wetting by the solder. The
nickel barrier termination is suitable for all commonly-used soldering methods.
Note: SMD NTCs with AgPd termination are not approved for lead-free soldering.
Figure 1
SMD NTC thermistors, structure of nickel barrier
Temperature measurement and compensation
Leaded NTC thermistors, lead spacing 2.5 mm
Page 16 of 28
Please read Cautions and warnings and
Important notes at the end of this document.

Html Pages

1  2  3  4  5  6  7  8  9  10  11  12  13  14  15  16  17  18  19  20  21  22  23  24  25  26  27  28 

Datasheet Download

Go To PDF Page

Link URL

Privacy Policy
Does ALLDATASHEET help your business so far?  [ DONATE ]  

About Alldatasheet   |   Advertisement   |   Datasheet Upload   |   Contact us   |   Privacy Policy   |   Alldatasheet API   |   Link Exchange   |   Manufacturer List
All Rights Reserved© Alldatasheet.com

Mirror Sites
English : Alldatasheet.com  |   English : Alldatasheet.net  |   Chinese : Alldatasheetcn.com  |   German : Alldatasheetde.com  |   Japanese : Alldatasheet.jp
Russian : Alldatasheetru.com  |   Korean : Alldatasheet.co.kr  |   Spanish : Alldatasheet.es  |   French : Alldatasheet.fr  |   Italian : Alldatasheetit.com
Portuguese : Alldatasheetpt.com  |   Polish : Alldatasheet.pl  |   Vietnamese : Alldatasheet.vn