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OPA548T Datasheet(PDF) 10 Page - Texas Instruments |
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OPA548T Datasheet(HTML) 10 Page - Texas Instruments |
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10 / 24 page  OPA548 10 SBOS070B www.ti.com THERMAL RESISTANCE vs CIRCUIT BOARD COPPER AREA 50 40 30 20 10 0 012345 Copper Area (inches2) OPA548F Surface Mount Package 1oz copper Circuit Board Copper Area OPA548 Surface-Mount Package FIGURE 5. TO-220 Thermal Resistance vs Aluminum Plate Area. FIGURE 6. DDPAK Thermal Resistance vs Circuit Board Copper Area. conducting output transistor. Power dissipation can be mini- mized by using the lowest possible power-supply voltage necessary to assure the required output voltage swing. For resistive loads, the maximum power dissipation occurs at a dc output voltage of one-half the power-supply voltage. Dissipation with ac signals is lower. Application Bulletin SBOA022 explains how to calculate or measure power dissipation with unusual signals and loads. THERMAL PROTECTION Power dissipated in the OPA548 will cause the junction temperature to rise. The OPA548 has thermal shutdown circuitry that protects the amplifier from damage. The thermal protection circuitry disables the output when the junction temperature reaches approximately 160 °C, allowing the de- vice to cool. When the junction temperature cools to approxi- mately 140 °C, the output circuitry is again enabled. Depend- ing on load and signal conditions, the thermal protection circuit may cycle on and off. This limits the dissipation of the amplifier but may have an undesirable effect on the load. Any tendency to activate the thermal protection circuit indi- cates excessive power dissipation or an inadequate heat sink. For reliable operation, junction temperature should be limited to 125 °C, maximum. To estimate the margin of safety in a complete design (including heat sink) increase the ambient temperature until the thermal protection is triggered. Use worst-case load and signal conditions. For good reliabil- ity, thermal protection should trigger more than 35 °C above the maximum expected ambient condition of your applica- tion. This produces a junction temperature of 125 °C at the maximum expected ambient condition. The internal protection circuitry of the OPA548 was designed to protect against overload conditions. It was not intended to replace proper heat sinking. Continuously running the OPA548 into thermal shutdown will degrade reliability. 0 1 234567 8 18 16 14 12 10 8 Aluminum Plate Area (inches2) THERMAL RESISTANCE vs ALUMINUM PLATE AREA Aluminum Plate Area Flat, Rectangular Aluminum Plate OPA548 TO220 Package 0.030in Al 0.062in Al 0.050in Al Vertically Mounted in Free Air Optional mica or film insulator for electrical isolation. Adds approximately 1 °C/W. Aluminum Plate Thickness |
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