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STPS3150-Y Datasheet(PDF) 4 Page - STMicroelectronics |
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STPS3150-Y Datasheet(HTML) 4 Page - STMicroelectronics |
4 / 8 page Characteristics STPS3150-Y 4/7 Doc ID 018926 Rev 1 Figure 11. Thermal resistance junction to ambient versus copper surface under each lead Figure 9. Forward voltage drop versus forward current Figure 10. Forward voltage drop versus forward current I (A) FM 1 10 100 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 V (V) FM T =25°C (maximum values) j T =125°C (typical values) j T =125°C (maximum values) j I (A) FM 1 10 100 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 V (V) FM T =25°C (maximum values) j T =125°C (typical values) j T =125°C (maximum values) j R (°C/W) th(j-a) 0 10 20 30 40 50 60 70 80 90 100 110 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 S (cm²) Cu Epoxy printed circuit board FR4, copper thickness = 35 µm |
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