STM32F101ZC datasheet(11/112 Pages) STMICROELECTRONICS

Part #	STM32F101ZC

Description	High-density access line, ARM-based 32-bit MCU with 256 to 512 KB Flash, 9 timers

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STM32F101xC, STM32F101xD, STM32F101xE

Description

Doc ID 14610 Rev 8

11/112

2.1

Device overview

The STM32F101xx high-density access line family offers devices in 3 different package

types: from 64 pins to 144 pins. Depending on the device chosen, different sets of

peripherals are included, the description below gives an overview of the complete range of

peripherals proposed in this family.

●

Figure 1 shows the general block diagram of the device family.

Table 2.

STM32F101xC, STM32F101xD and STM32F101xE features and peripheral

counts

Peripherals

STM32F101Rx

STM32F101Vx

STM32F101Zx

Flash memory in Kbytes

256

384

512

256

384

512

256

384

512

SRAM in Kbytes

32

48

32

48

32

48

FSMC

No

Yes(1)

1.

For the LQFP100 package, only FSMC Bank1 and Bank2 are available. Bank1 can only support a

multiplexed NOR/PSRAM memory using the NE1 Chip Select. Bank2 can only support a 16- or 8-bit

NAND Flash memory using the NCE2 Chip Select. The interrupt line cannot be used since Port G is not

available in this package.

Yes

Timers

General-

purpose

4

Basic

2

Comm

SPI

3

I2C2

USART

5

GPIOs

51

80

112

12-bit ADC

Number of channels

1

16

1

16

1

16

12-bit DAC

Number of channels

1

2

CPU frequency

36 MHz

Operating voltage

2.0 to 3.6 V

Operating temperatures

Ambient temperature: –40 to +85 °C (see Table 10)

Junction temperature: –40 to +105 °C (see Table 10)

Package

LQFP64

LQFP100

LQFP144

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