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74VCX16835GX Datasheet(PDF) 1 Page - Fairchild Semiconductor |
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74VCX16835GX Datasheet(HTML) 1 Page - Fairchild Semiconductor |
1 / 10 page © 2001 Fairchild Semiconductor Corporation DS500173 www.fairchildsemi.com October 1998 Revised August 2001 74VCX16835 Low Voltage 18-Bit Universal Bus Driver with 3.6V Tolerant Inputs and Outputs General Description The VCX16835 low voltage 18-bit universal bus driver combines D-type latches and D-type flip-flops to allow data flow in transparent, latched and clocked modes. Data flow is controlled by output-enable (OE), latch-enable (LE), and clock (CLK) inputs. The device operates in Transparent Mode when LE is held HIGH. The device operates in clocked mode when LE is LOW and CLK is tog- gled. Data transfers from the Inputs (In) to Ouputs (On) on a Positive Edge Transition of the Clock. When OE is LOW, the output data is enabled. When OE is HIGH the output port is in a high impedance state. The 74VCX16835 is designed for low voltage (1.65V to 3.6V) VCC applications with I/O capability up to 3.6V. The 74VCX16835 is fabricated with an advanced CMOS technology to achieve high speed operation while maintain- ing low CMOS power dissipation. Features s Compatible with PC100 DIMM module specifications s 1.65V–3.6V VCC supply operation s 3.6V tolerant inputs and outputs s tPD (CLK to On) 4.2ns max for 3.0V to 3.6V VCC 5.2ns max for 2.3V to 2.7V VCC 9.2ns max for 1.65V to 1.95V VCC s Power-down high impedance inputs and outputs s Supports live insertion/withdrawal (Note 1) s Static Drive (IOH/IOL) ±24mA @ 3.0V ±18mA @ 2.3V ±6mA @ 1.65V s Latchup performance exceeds 300 mA s ESD performance: Human body model > 2000V Machine model >200V s Also packaged in plastic Fine-Pitch Ball Grid Array (FBGA) (Preliminary) Note 1: To ensure the high-impedance state during power up or power down, OE should be tied to VCC (OE to GND) through a pulldown resistor; the minimum value of the resistor is determined by the current sourcing capability of the driver. Ordering Code: Note 2: BGA package available in Tape and Reel only. Note 3: Devices also available in Tape and Reel. Specify by appending the suffix letter “X” to the ordering code. Order Number Package Number Package Description 74VCX16835GX (Note 2) BGA54A (Preliminary) 54-Ball Fine-Pitch Ball Grid Array (FBGA), JEDEC MO-205, 5.5mm Wide [TAPE and REEL] 74VCX16835MTD (Note 3) MTD56 56-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 6.1mm Wide |
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