AN26024A

10

Ver. CEB

USAGE NOTES

1. When designing your equipment, comply with the range of absolute maximum rating and the guaranteed

operating conditions (operating power supply voltage and operating environment etc.). Especially, please be

careful not to exceed the range of absolute maximum rating on the transient state, such as power-on, power-off

and mode-switching. Otherwise, we will not be liable for any defect which may arise later in your equipment.

Even when the products are used within the guaranteed values, take into the consideration of incidence of

break down and failure mode, possible to occur to semiconductor products. Measures on the systems such as

redundant design, arresting the spread of fire or preventing glitch are recommended in order to prevent physical

injury, fire, social damages, for example, by using the products.

2. Comply with the instructions for use in order to prevent breakdown and characteristics change due to external

factors (ESD, EOS, thermal stress and mechanical stress) at the time of handling, mounting or at customer's

process. When using products for which damp-proof packing is required, satisfy the conditions, such as shelf

life and the elapsed time since first opening the packages.

3. Pay attention to the direction of LSI. When mounting it in the wrong direction onto the PCB (printed-circuit-board),

it might smoke or ignite.

4. Pay attention in the PCB (printed-circuit-board) pattern layout in order to prevent damage due to short circuit

between pins. In addition, refer to the Pin Description for the pin configuration.

5. Perform a visual inspection on the PCB before applying power, otherwise damage might happen due to problems

such as a solder-bridge between the pins of the semiconductor device. Also, perform a full technical verification

on the assembly quality, because the same damage possibly can happen due to conductive substances, such

as solder ball, that adhere to the LSI during transportation.

6. Take notice in the use of this product that it might break or occasionally smoke when an abnormal state occurs

such as output pin-VCC short (Power supply fault), output pin-GND short (Ground fault), or output-to-output-pin

short (load short) .

And, safety measures such as an installation of fuses are recommended because the extent of the above-

mentioned damage and smoke emission will depend on the current capability of the power supply.

7. Due to unshielded structure of this LSI, under exposure of light, function and characteristic of the product cannot

be guaranteed. During normal operation or even under testing condition, please ensure that LSI is not exposed

to light.

8. Basically, chip surface is ground potential. Please design to ensure no contact between chip surface and metal

shielding.