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PA28F200B5T60 Datasheet(PDF) 3 Page - Intel Corporation |
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PA28F200B5T60 Datasheet(HTML) 3 Page - Intel Corporation |
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3 / 44 page  E 28F200B5, 28F004/400B5, 28F800B5 3 PRELIMINARY CONTENTS PAGE PAGE 1.0 INTRODUCTION..............................................5 1.1 Product Overview .........................................5 2.0 PRODUCT DESCRIPTION ..............................6 2.1 Pin Descriptions ...........................................6 2.2 Pinouts .........................................................8 2.3 Memory Blocking Organization...................10 2.3.1 One 16-KB Boot Block.........................10 2.3.2 Two 8-KB Parameter Blocks................10 2.3.3 Main Blocks - One 96-KB + Additional 128-KB Blocks....................................10 3.0 PRINCIPLES OF OPERATION .....................13 3.1 Bus Operations ..........................................13 3.1.1 Read....................................................13 3.1.2 Output Disable.....................................14 3.1.3 Standby ...............................................14 3.1.4 Word/Byte Configuration......................14 3.1.5 Deep Power-Down/Reset ....................14 3.1.6 Write....................................................14 3.2 Modes of Operation....................................16 3.2.1 Read Array ..........................................16 3.2.2 Read Identifier .....................................16 3.2.3 Read Status Register...........................16 3.2.4 Word/Byte Program .............................17 3.2.5 Block Erase .........................................17 3.3 Boot Block Locking.....................................24 3.3.1 VPP = VIL for Complete Protection........24 3.3.2 WP# = VIL for Boot Block Locking........24 3.3.3 RP# = VHH or WP# = VIH for Boot Block Unlocking ...........................................24 3.3.4 Note For 8-Mbit 44-PSOP Package .....24 4.0 DESIGN CONSIDERATIONS ........................24 4.1 Power Consumption ...................................24 4.1.1 Active Power .......................................24 4.1.2 Automatic Power Savings (APS) .........24 4.1.3 Standby Power ....................................25 4.1.4 Deep Power-Down Mode.....................25 4.2 Power-Up/Down Operation........................ 25 4.2.1 RP# Connected To System Reset ...... 25 4.3 Board Design............................................. 25 4.3.1 Power Supply Decoupling ................... 25 4.3.2 VPP Trace on Printed Circuit Boards ... 25 5.0 ELECTRICAL SPECIFICATIONS................. 26 5.1 Absolute Maximum Ratings ....................... 26 5.2 Operating Conditions................................. 26 5.3 Capacitance .............................................. 27 5.4 DC Characteristics—Commercial and Extended Temperature ............................. 27 5.5 DC Characteristics—Automotive Temperature............................................. 29 5.6 AC Characteristics—Read Operations— Commercial and Extended Temperature .. 34 5.7 AC Characteristics—Read Operations— Automotive Temperature .......................... 35 5.8 Erase and Program Timings—Commercial and Extended Temperature ...................... 36 5.9 Erase and Program Timings—Automotive Temperature............................................. 37 5.10 AC Characteristics—Write Operations— Commercial and Extended Temperature .. 38 5.11 AC Characteristics—Write Operations— Automotive Temperature .......................... 39 6.0 ORDERING INFORMATION......................... 41 7.0 ADDITIONAL INFORMATION ...................... 42 APPENDIX A: Write State Machine: Current- Next State Chart ......................................... 43 APPENDIX B: Product Block Diagram ............. 44 |
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