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SPX1117M3-L-1-5 Datasheet(PDF) 6 Page - Exar Corporation |
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SPX1117M3-L-1-5 Datasheet(HTML) 6 Page - Exar Corporation |
6 / 11 page S SP PX X1 11 11 17 7 8 80 00 0m mA A L Lo ow w D Drro op po ou utt V Vo olltta ag ge e R Re eg gu ulla atto orr © 2011 Exar Corporation 6/11 Rev. 2.1.0 APPLICATION INFORMATION OUTPUT CAPACITOR To ensure the stability of the SPX1117, an output capacitor of at least 2.2µF (tantalum or ceramic) or 10µF (aluminum) is required. The value may change based on the application requirements of the output load or temperature range. The value of ESR can vary based on the type of capacitor used in the applications to guarantee stability. The recommended value for ESR is 0.5Ωor less. A larger value of output capacitance (up to 100µF) can improve the load transient response. Fig. 16: Load Step Response 0mA to 800mA VIN=3.3V, VOUT=1.8V, CIN=10µF, COUT=2.2µF, Ceramic Signal 1=VOUT, Signal 4=ILOAD Fig. 17: Load Step Response 0mA to 800mA VIN=3.3V, VOUT=1.8V, CIN=10µF, COUT=2.2µF, OSCON Signal 1=VOUT, Signal 4=ILOAD Fig. 18 SOLDERING METHODS The SPX1117 SOT-223 package is designed to be compatible with infrared reflow or vapor- phase reflow soldering techniques. During soldering, the non-active or mildly active fluxes may be used. The SPX1117 die is attached to the heatsink lead which exits opposite the input, output, and ground pins. Hand soldering and wave soldering should be avoided since these methods can cause damage to the device with excessive thermal gradients on the package. The SOT-223 recommended soldering method are as follows: vapor phase reflow and infrared reflow with the component preheated to within 65C of the soldering temperature range. THERMAL CHARACTERISTICS The thermal resistance of SPX1117 (SOT-223 package) is 15°C/W from junction to tab and 31°C/W from tab to ambient for a total of 46 °C/W from junction to ambient (Table 1). The SPX1117 features the internal thermal limiting to protect the device during overload conditions. Special care needs to be taken during continuous load conditions such that the maximum junction temperature does not exceed 125 °C. Thermal protection is activated at >155°C and deactivated at <140 °C. Taking the FR-4 printed circuit board and 1/16 thick with 1 ounce copper foil as an experiment (fig.19), the PCB material is effective at transmitting heat with the tab attached to the pad area and a ground plane |
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