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74LCXZ16244 Datasheet(PDF) 1 Page - Fairchild Semiconductor

Part No. 74LCXZ16244
Description  Low Voltage 16-Bit Buffer/Line Driver with 5V Tolerant Inputs and Outputs
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Maker  FAIRCHILD [Fairchild Semiconductor]
Homepage  http://www.fairchildsemi.com

74LCXZ16244 Datasheet(HTML) 1 Page - Fairchild Semiconductor

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© 2001 Fairchild Semiconductor Corporation
September 2000
Revised August 2001
Low Voltage 16-Bit Buffer/Line Driver
with 5V Tolerant Inputs and Outputs
General Description
The LCXZ16244 contains sixteen non-inverting buffers
with 3-STATE outputs designed to be employed as a mem-
ory and address driver, clock driver, or bus oriented trans-
mitter/receiver. The device is nibble controlled. Each nibble
has separate 3-STATE control inputs which can be shorted
together for full 16-bit operation.
When VCC is between 0 and 1.5V, the LCXZ12644 is in the
high impedance state during power up or power down. This
places the outputs in high impedance (Z) state preventing
intermittent low impedance loading or glitching in bus ori-
ented applications.
The LCXZ16244 is designed for low voltage (2.7V or 3.3V)
VCC applications with capability of interfacing to a 5V signal
The LCXZ16244 is fabricated with an advanced CMOS
technology to achieve high speed operation while maintain-
ing CMOS low power dissipation.
I 5V tolerant inputs and outputs
I Guaranteed power up/down high impedance
I Supports live insertion/withdrawal
I 2.7V–3.6V VCC specifications provided
I 4.5 ns tPD max (VCC = 3.0V), 20 µA ICC max
±24 mA output drive (VCC = 3.0V)
I Implements patented noise/EMI reduction circuitry
I Latch-up performance exceeds 500 mA
I ESD performance:
Human body model
> 2000V
Machine model
> 200V
I Also packaged in plastic Fine-Pitch Ball Grid Array
(FBGA) (Preliminary)
Ordering Code:
Note 1: BGA package available in Tape and Reel only.
Note 2: Devices also available in Tape and Reel. Specify by appending the suffix letter “X” to the ordering code.
Logic Symbol
Order Number
Package Number
Package Description
(Note 1)
54-Ball Fine-Pitch Ball Grid Array (FBGA), JEDEC MO-205, 5.5mm Wide
(Note 2)
48-Lead Small Shrink Outline Package (SSOP), JEDEC MO-118, 0.300" Wide
(Note 2)
48-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 6.1mm Wide

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