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HS1-26C31RH-Q Datasheet(PDF) 3 Page - Intersil Corporation |
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HS1-26C31RH-Q Datasheet(HTML) 3 Page - Intersil Corporation |
3 / 3 page HS-26C31RH, HS-26C31EH 3 FN3401.6 January 8, 2013 Die Characteristics DIE DIMENSIONS: 96.5 mils x 195 mils x 21 mils (2450 x 4950) INTERFACE MATERIALS: Glassivation: Type: PSG (Phosphorus Silicon Glass) Thickness: 10k Å ±1kÅ Metallization: M1: Mo/TiW Thickness: 5800 Å M2: Al/Si/Cu (Top) Thickness: 10k Å ±1kÅ Substrate: AVLSI1RA Backside Finish: Silicon ASSEMBLY RELATED INFORMATION: Substrate Potential (Powered Up): VDD ADDITIONAL INFORMATION: Worst Case Current Density: <2.0x105A/cm2 Bond Pad Size: 110µmx100µm Metallization Mask Layout HS-26C31RH, HS-26C31EH (14) DO (13) DO (12) ENABLE (11) CO (10) CO AO (2) AO (3) ENABLE (4) BO (5) BO (6) |
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