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74ALVC16374 Datasheet(PDF) 1 Page - Fairchild Semiconductor

Part No. 74ALVC16374
Description  Low Voltage 16-Bit D-Type Flip-Flop with 3.6V Tolerant Inputs and Outputs
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Maker  FAIRCHILD [Fairchild Semiconductor]
Homepage  http://www.fairchildsemi.com
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74ALVC16374 Datasheet(HTML) 1 Page - Fairchild Semiconductor

   
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© 2005 Fairchild Semiconductor Corporation
DS500692
www.fairchildsemi.com
October 2001
Revised May 2005
74ALVC16374
Low Voltage 16-Bit D-Type Flip-Flop
with 3.6V Tolerant Inputs and Outputs
General Description
The ALVC16374 contains sixteen non-inverting D-type flip-
flops with 3-STATE outputs and is intended for bus oriented
applications. The device is byte controlled. A buffered clock
(CP) and output enable (OE) are common to each byte and
can be shorted together for full 16-bit operation.
The 74ALVC16374 is designed for low voltage (1.65V to
3.6V) VCC applications with I/O compatibility up to 3.6V.
The 74ALVC16374 is fabricated with an advanced CMOS
technology to achieve high speed operation while maintain-
ing low CMOS power dissipation.
Features
s 1.65V - 3.6V VCC supply operation
s 3.6V tolerant inputs and outputs
s tPD
3.5 ns max for 3.0V to 3.6V VCC
4.4 ns max for 2.3V to 2.7V VCC
7.8 ns max for 1.65V to 1.95V VCC
s Power-off high impedance inputs and outputs
s Supports live insertion and withdrawal (Note 1)
s Uses patented noise/EMI reduction circuitry
s Latchup conforms to JEDEC JED78
s ESD performance:
Human body model
! 2000V
Machine model
! 200V
s Also packaged in plastic Fine-Pitch Ball Grid Array
(FBGA)
Note 1: To ensure the high-impedance state during power up or power
down, OE should be tied to VCC through a pull-up resistor; the minimum
value of the resistor is determined by the current-sourcing capability of the
driver.
Ordering Code:
Note 2: BGA package available in Tape and Reel only.
Note 3: Devices also available in Tape and Reel. Specify by appending suffix letter “X” to the ordering code.
Order Number
Package Number
Package Descriptions
74ALVC16374GX
(Note 2)
BGA54A
54-Ball Fine-Pitch Ball Grid Array (FBGA), JEDEC MO-205, 5.5mm Wide
[TAPE and REEL]
74ALVC16374MTD
(Note 3)
MTD48
48-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 6.1mm Wide


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