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D2570H886 Datasheet(PDF) 3 Page - Agere Systems |
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D2570H886 Datasheet(HTML) 3 Page - Agere Systems |
3 / 12 page Data Sheet, Rev. 3 D2570, D2526G, D2555 Wavelength-Selected July 2001 Direct Modulated Isolated DFB Laser Module Agere Systems Inc. 3 Absolute Maximum Ratings Stresses in excess of the absolute maximum ratings can cause permanent damage to the device. These are abso- lute stress ratings only. Functional operation of the device is not implied at these or any other conditions in excess of those given in the performance characteristics of the data sheet. Exposure to absolute maximum ratings for extended periods can adversely affect device reliability. * Does not apply to shipping container. Parameter Symbol Min Max Unit Laser Reverse Voltage VRLMAX —2 V dc Forward Current IFLMAX —150 mA Operating Case Temperature Range TC –40 70 °C Storage Case Temperature Range* Tstg –40 85 °C Photodiode Reverse Voltage VRPDMAX —10 V Photodiode Forward Current IFPDMAX —2 mA Handling Precautions Power Sequencing To avoid the possibility of damage to the laser module from power supply switching transients, follow this turn- on sequence: 1. All ground connections 2. Most negative supply 3. Most positive supply 4. All remaining connections Reverse the order for the proper turn-off sequence. Electrostatic Discharge CAUTION: This device is susceptible to damage as a result of electrostatic discharge. Take proper precautions during both handling and testing. Follow guide- lines such as JEDEC Publication No. 108-A (Dec. 1988). Agere Systems employs a human-body model (HBM) for ESD-susceptibility testing and protection-design evaluation. ESD voltage thresholds are dependent on the critical parameters used to define the model. A standard HBM (resistance = 1.5 k¾, capacitance = 100 pF) is widely used and, therefore, can be used for comparison purposes. The HBM ESD threshold pre- sented here was obtained using these circuit parame- ters: Mounting Instructions The minimum fiber bend radius is 1.23 in (31.25 mm). To avoid degradation in performance, mount the mod- ule on the board as follows: 1. Place the bottom flange of the module on a flat heat sink at least 0.5 in. x 1.180 in. (12.7 mm x 30 mm) in size. The surface finish of the heat sink should be better than 32 µin. (0.8 µm), and the surface flatness must be better than 0.001 in. (25.4 µm). Using ther- mal conductive grease is optional; however, thermal performance can be improved by up to 5% if con- ductive grease is applied between the bottom flange and the heat sink. 2. Mount four #2-56 screws with Fillister heads (M2-3 mm) at the four screw hole locations (see Outline Diagram). The Fillister head diameter must not exceed 0.140 in. (3.55 mm). Do not apply more than 1 in./lb. of torque to the screws. Figure 2. Fillister Head Screw Parameter Value Unit Human-body Model >400 V 1-532 Note: Dimensions are in inches and (millimeters). 0.118 (3.00) 0.062 (1.58) 0.140 (3.56) 0.031 (0.79) 0.129 (3.28) R 0.086 (2.18) 0.041 (1.04) |
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