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DSP16410C Datasheet(PDF) 14 Page - Agere Systems |
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DSP16410C Datasheet(HTML) 14 Page - Agere Systems |
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14 / 373 page  Data Addendum May 2001 DSP16410C Digital Signal Processor Agere Systems Inc. 14 6 Device Characteristics (continued) 6.3 Recommended Operating Conditions The ratio of the instruction cycle rate to the input clock frequency is 1:1 without the PLL and ((M + 2)/((D + 2) * f(OD))):1 with the PLL selected. The maximum input clock (CKI pin) frequency when the PLL is not selected as the device clock source is 50 MHz. The maximum input clock frequency is 40 MHz when the PLL is selected. 6.3.1 Package Thermal Considerations The maximum allowable ambient temperature, TAMAX, is dependent upon the device power dissipation and is deter- mined by the following equation: TAMAX = TJMAX – PMAX x ΘJA Where PMAX is the maximum device power dissipation for the application, TJMAX is the maximum device junction temperature specified in Table 6, and ΘJA is the maximum thermal resistance in still-air-ambient specified in Table 6. See Section 7.3 for information on determining the maximum device power dissipation. WARNING: Due to package thermal constraints, proper precautions in the user's application should be taken to avoid exceeding the maximum junction temperature of 120 °C. Otherwise, the device performance and reliability is adversely affected. Table 5. Recommended Operating Conditions Maximum Internal Clock (CLK) Frequency Minimum Internal Clock (CLK) Period T Junction Temperature TJ ( °C) Supply Voltage VDD1, VDD1A (V) Supply Voltage VDD2 (V) Min Max Min Max Min Max 200 MHz 5.0 ns –40 120 1.5 1.65 3.0 3.6 Table 6. Package Thermal Considerations Device Package Parameter Value Unit 208 PBGA Maximum Junction Temperature (TJMAX) 120 °C 208 PBGA Maximum Thermal Resistance in Still-Air-Ambient ( ΘJA)27 °C/W 256 EBGA Maximum Junction Temperature (TJMAX) 120 °C 256 EBGA Maximum Thermal Resistance in Still-Air-Ambient ( ΘJA)15 °C/W |
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