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D374-10F Datasheet(PDF) 2 Page - Agere Systems

Part # D374-10F
Description  D374-Type Digital Uncooled 2.5 Gbits/s Laser Module
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Manufacturer  AGERE [Agere Systems]
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Data Sheet
D374-Type Digital Uncooled 2.5 Gbits/s Laser Module
December 2000
2
2
Agere Systems Inc.
Description (continued)
The device characteristics listed in this document are
met at 1.0 mW output power. Higher- or lower-power
operation is possible. Under conditions of a fixed pho-
todiode current, the change in optical output is typically
±0.5 dB over an operating temperature range of –40 °C
to +85
°C.
This device incorporates the new Laser 2000 manufac-
turing process developed by the Optoelectronic unit of
Agere Systems Inc. Laser 2000 is a low-cost platform
that targets high-volume manufacturing and tight prod-
uct distributions on all optical subassemblies. This plat-
form incorporates an advanced optical design that is
produced on a highly automated production line. The
Laser 2000 platform is qualified for the central office
and uncontrolled environments, and can be used for
applications requiring high performance and low cost.
Table 1. Pin Descriptions
Pin Number
Connection
1
NC/reserved
2
Case ground
3
NC/reserved
4
PD cathode
5
PD anode
6
Laser diode anode (+)
7
Laser RF input cathode (–), 25
8
Laser diode anode (+)
Figure 1. D374-Type Digital Uncooled 2.5 Gbits/s Laser Module Schematic, Top View
Absolute Maximum Ratings
Stresses in excess of the absolute maximum ratings can cause permanent damage to the device. These are abso-
lute stress ratings only. Functional operation of the device is not implied at these or any other conditions in excess
of those given in the operations sections of the data sheet. Exposure to absolute maximum ratings for extended
periods can adversely affect device reliability.
* Rating varies with temperature.
Parameter
Symbol
Min
Max
Unit
Maximum Peak Laser Drive Current or
Maximum Fiber Power*
IOP
PMAX
150
10
mA
mW
Peak Reverse Laser Voltage:
Laser
Monitor
VRL
VRD
2
20
V
V
Monitor Forward Current
IFD
—2
mA
Operating Case Temperature Range
TC
–40
85
°C
Storage Case Temperature Range
Tstg
–40
85
°C
Lead Soldering Temperature/Time
260/10
°C/s
Relative Humidity (noncondensing)
RH
85
%
56
8
7
4
3
1
2
1-900


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