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06031C222KAZ2A Datasheet(PDF) 91 Page - AVX Corporation |
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06031C222KAZ2A Datasheet(HTML) 91 Page - AVX Corporation |
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91 / 135 page  90 Surface Mounting Guide MLC Chip Capacitors and a target figure 2°C/second is recommended. Although an 80°C to 120°C temperature differential is preferred, recent developments allow a temperature differential between the component surface and the soldering temper- ature of 150°C (Maximum) for capacitors of 1210 size and below with a maximum thickness of 1.25mm. The user is cautioned that the risk of thermal shock increases as chip size or temper-ature differential increases. Soldering Mildly activated rosin fluxes are preferred. The minimum amount of solder to give a good joint should be used. Excessive solder can lead to damage from the stresses caused by the difference in coefficients of expansion between solder, chip and substrate. AVX terminations are suitable for all wave and reflow soldering systems. If hand soldering cannot be avoided, the preferred technique is the utilization of hot air soldering tools. Cooling Natural cooling in air is preferred, as this minimizes stresses within the soldered joint. When forced air cooling is used, cooling rate should not exceed 4°C/second. Quenching is not recommended but if used, maximum temperature differentials should be observed according to the preheat conditions above. Cleaning Flux residues may be hygroscopic or acidic and must be removed. AVX MLC capacitors are acceptable for use with all of the solvents described in the specifications MIL-STD- 202 and EIA-RS-198. Alcohol based solvents are acceptable and properly controlled water cleaning systems are also acceptable. Many other solvents have been proven successful, and most solvents that are acceptable to other components on circuit assemblies are equally acceptable for use with ceramic capacitors. POST SOLDER HANDLING Once SMP components are soldered to the board, any bending or flexure of the PCB applies stresses to the sol- dered joints of the components. For leaded devices, the stresses are absorbed by the compliancy of the metal leads and generally don’t result in problems unless the stress is large enough to fracture the soldered connection. Ceramic capacitors are more susceptible to such stress because they don’t have compliant leads and are brittle in nature. The most frequent failure mode is low DC resistance or short circuit. The second failure mode is significant loss of capacitance due to severing of contact between sets of the internal electrodes. Cracks caused by mechanical flexure are very easily identi- fied and generally take one of the following two general forms: Mechanical cracks are often hidden underneath the termina- tion and are difficult to see externally. However, if one end termination falls off during the removal process from PCB, this is one indication that the cause of failure was excessive mechanical stress due to board warping. Type A: Angled crack between bottom of device to top of solder joint. Type B: Fracture from top of device to bottom of device. |
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