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OP97EJ Datasheet(PDF) 3 Page - Analog Devices |
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OP97EJ Datasheet(HTML) 3 Page - Analog Devices |
3 / 12 page REV. D OP97 –3– CAUTION ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the human body and test equipment and can discharge without detection. Although the OP97 features proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high-energy electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of functionality. WARNING! ESD SENSITIVE DEVICE ABSOLUTE MAXIMUM RATINGS 1 Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±20 V Input Voltage 2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±20 V Differential Input Voltage 3 . . . . . . . . . . . . . . . . . . . . . . ±1 V Differential Input Current 3 . . . . . . . . . . . . . . . . . . . . ±10 mA Output Short-Circuit Duration . . . . . . . . . . . . . . . . Indefinite Operating Temperature Range OP97A (Z) . . . . . . . . . . . . . . . . . . . . . . . . –55 °C to +125°C OP97E, F (P, Z, S) . . . . . . . . . . . . . . . . . . –40 °C to +85°C Storage Temperature Range . . . . . . . . . . . . –65 °C to +150°C Junction Temperature Range . . . . . . . . . . . . –65 °C to +150°C Lead Temperature (Soldering, 60 sec) . . . . . . . . . . . . 300 °C Package Type JA 4 JC Unit 8-Lead Hermetic DIP (Z) 148 16 °C/W 8-Lead Plastic DIP (P) 103 43 °C/W 8-Lead SO (S) 158 43 °C/W NOTES 1Absolute maximum ratings apply to both DICE and packaged parts, unless otherwise noted. 2For supply voltages less than ±20 V, the absolute maximum input voltage is equal to the supply voltage. 3The OP97’s inputs are protected by back-to-back diodes. Current-limiting resis- tors are not used in order to achieve low noise. Differential input voltages greater than 1 V will cause excessive current to flow through the input protection diodes unless limiting resistance is used. 4 θJA is specified for worst case mounting conditions, i.e., θJA is specified for device in socket for TO, cerdip, and P-DIP packages; θJA is specified for device soldered to printed circuit board for SO package. ORDERING GUIDE Temperature Package Model Range Option1 OP97AZ 3 –55 °C to +125°C 8-Lead Cerdip OP97ARC/883 2, 3 –55 °C to +125°C 20-Contact LCC OP97EJ 3 –40 °C to +85°C TO-99 OP97EZ 3 –40 °C to +85°C 8-Lead Cerdip OP97EP –40 °C to +85°C 8-Lead Plastic DIP OP97FZ 3 –40 °C to +85°C 8-Lead Cerdip OP97FP –40 °C to +85°C 8-Lead Plastic DIP OP97FS –40 °C to +85°C 8-Lead SOIC OP97FS-REEL –40 °C to +85°C 8-Lead SOIC OP97FS-REEL7 –40 °C to +85°C 8-Lead SOIC NOTES 1For outline information see Package Information section. 2For devices processed in total compliance to MIL-STD-883, add /883 after part number. Consult factory for /883 data sheet. 3Not for new designs; obsolete April 2002. For Military processed devices, please refer to the Standard Microcircuit Drawing (SMD) available at www.dscc.dla.mil/programs/milspec/default.asp SMD Part Number ADI Equivalent 59628954401PA OP97AZMDA 59628954401GA* OP97AJMDA * Not for new designs; obsolete April 2002. |
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