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OP467GP Datasheet(PDF) 4 Page - Analog Devices |
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OP467GP Datasheet(HTML) 4 Page - Analog Devices |
4 / 16 page OP467 REV. C –4– WAFER TEST LIMITS1 Parameter Symbol Conditions Limit Units Offset Voltage VOS ±0.5 mV max Input Bias Current IB VCM = 0 V 600 nA max Input Offset Current IOS VCM = 0 V 100 nA max Input Voltage Range 2 ±12 V min/max Common-Mode Rejection Ratio CMRR VCM = ±12 V 80 dB min Power Supply Rejection Ratio PSRR V = ±4.5 V to ±18 V 96 dB min Large Signal Voltage Gain AVO RL = 2 k Ω 83 dB min Output Voltage Range VO RL = 2 k Ω±13.0 V min Supply Current ISY VO = 0 V, RL = ∞ 10 mA max NOTES 1Electrical tests and wafer probe to the limits shown. Due to variations in assembly methods and normal yield loss, yield after packaging is not guaranteed for standard product dice. Consult factory to negotiate specifications based on dice lot qualifications through sample lot assembly and testing. 2Guaranteed by CMR test. ABSOLUTE MAXIMUM RATINGS 1 Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±18 V Input Voltage 2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±18 V Differential Input Voltage 2 . . . . . . . . . . . . . . . . . . . . . . ±26 V Output Short-Circuit Duration . . . . . . . . . . . . . . . . . . Limited Storage Temperature Range Y, RC Packages . . . . . . . . . . . . . . . . . . . . –65 °C to +175°C P, S Packages . . . . . . . . . . . . . . . . . . . . . . –65 °C to +150°C Operating Temperature Range OP467A . . . . . . . . . . . . . . . . . . . . . . . . . . –55 °C to +125°C OP467G . . . . . . . . . . . . . . . . . . . . . . . . . . . –40 °C to +85°C Junction Temperature Range Y, RC Packages . . . . . . . . . . . . . . . . . . . . –65 °C to +175°C P, S Packages . . . . . . . . . . . . . . . . . . . . . . –65 °C to +150°C Lead Temperature Range (Soldering, 60 sec) . . . . . . . +300 °C Package Type A 3 JC Units 14-Lead Cerdip (Y) 94 10 °C/W 14-Lead Plastic DIP (P) 76 33 °C/W 16-Lead SOL (S) 88 23 °C/W 20-Contact LCC (RC) 78 33 °C/W NOTES 1Absolute maximum ratings apply to both DICE and packaged parts, unless otherwise noted. 2For supply voltages less than ±18 V, the absolute maximum input voltage is equal to the supply voltage. 3 θ JA is specified for the worst case conditions, i.e., θJA is specified for device in socket for cerdip, P-DIP, and LCC packages; θ JA is specified for device soldered in circuit board for SOIC package. ORDERING GUIDE Temperature Package Package Model Ranges Descriptions Options OP467AY/883 –55 °C to +125°C 14-Lead Cerdip Q-14 OP467ARC/883 –55 °C to +125°C 20-Contact LCC E-20A OP467GP –40 °C to +85°C 14-Lead Plastic DIP N-14 OP467GS –40 °C to +85°C 16-Lead SOL R-16 OP467GBC +25 °C DICE DICE CHARACTERISTICS OP467 Die Size 0.111 0.100 inch, 11,100 sq. mils Sub- strate is Connected to V+, Number of Transistors 165. ( @ VS = 15.0 V, TA = +25 C unless otherwise noted.) |
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