Electronic Components Datasheet Search |
|
OP400GP Datasheet(PDF) 4 Page - Analog Devices |
|
OP400GP Datasheet(HTML) 4 Page - Analog Devices |
4 / 12 page –4– OP400 REV. A CAUTION ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the human body and test equipment and can discharge without detection. Although the OP400 features proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high-energy electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of functionality. WARNING! ESD SENSITIVE DEVICE DIE SIZE 0.181 0.123 inch, 22,263 sq. milts (4.60 3.12 mm, 14.35 sq. mm) ORDERING INFORMATION TA = 25 C Package Operating VOS Max CerDIP Temperature (mV) 14-Lead Plastic Range 150 OP400AY MIL 150 OP400EY IND 230 OP400FY IND 300 OP400GP COM 300 OP400GS COM 300 OP400HP XIND 300 OP400HS XIND NOTES 1For devices processed in total compliance to MIL-STD-883, add/883after part number. Consult factory for 883 data sheet. 2Burn-in is available on commercial and industrial temperature range parts in CerDIP, plastic DIP, and TO-can packages. For Military processed devices, please refer to the standard microcircuit drawing (SMD) available at www.dscc.dla.mil/programs/milspec/default.asp SMD Part Number ADI Equivalent 5962-8777101M3A OP400ATCMDA 5962-8777101MCA OP400AYMDA OP400GBC Parameter Symbol Conditions Limit Unit Input Offset Voltage VOS 230 mA Max Input Offset Current VOS VCM = 0 V 2 nA Max Input Bias Current IB VCM = 0 V 6 nA Max Large Signal AVO VO = ±10 V RL = 10 kW 3000 Voltage Gain Rig 2 k W 1500 V/mV Min Input Voltage Range* IVR * ±12 V Min Common Mode Rejection CMR VCM = ±12 V 115 dB Min Power Supply Rejection Ratio PSRR VS = ±3 V to ±18 V 3.2 mV/V Max Output Voltage Swing VO RL = 10 k W RL = 2 k W±12 V Min Supply Current Per Amplifier ISY No Load 725 mA Max NOTE * Guaranteed by CMR test. Electrical tests are performed at wafer probe to the limits shown Due to variations in assembly methods and normal yield loss, yield after packaging is not guaranteed for standard product dice. Consult factory to negotiate specifications based on dice lot qualification through sample lot assembly and testing. 1. OUT A 8. OUT C 2. –IN A 9. –IN C 3. +INA 10. +IN C 4. V+ 11. V- 5. +IN B 12. +IND 6. –IN B 13. –IN D 7. OUT B 14. OUT D DICE CHARACTERISTICS WAFER TEST LIMITS (@ V S = 15 V, TA = 25 C, unless otherwise noted.) |
Similar Part No. - OP400GP |
|
Similar Description - OP400GP |
|
|
Link URL |
Privacy Policy |
ALLDATASHEET.COM |
Does ALLDATASHEET help your business so far? [ DONATE ] |
About Alldatasheet | Advertisement | Datasheet Upload | Contact us | Privacy Policy | Link Exchange | Manufacturer List All Rights Reserved©Alldatasheet.com |
Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
Family Site : ic2ic.com |
icmetro.com |