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DIM400XCM33-F000 Datasheet(PDF) 1 Page - Dynex Semiconductor

Part # DIM400XCM33-F000
Description  IGBT Chopper Module
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Manufacturer  DYNEX [Dynex Semiconductor]
Direct Link  http://www.dynexsemi.com
Logo DYNEX - Dynex Semiconductor

DIM400XCM33-F000 Datasheet(HTML) 1 Page - Dynex Semiconductor

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DIM400XCM33-F000
IGBT Chopper Module
Replaces DS5938-1.0
DS5938-2 May 2011 (LN28404)
Caution: This device is sensitive to electrostatic discharge. Users should follow ESD handling procedures
1/8
www.dynexsemi.com
FEATURES
10µs Short Circuit Withstand
High Thermal Cycling Capability
Soft Punch Through Silicon
Isolated AlSiC Base with AlN Substrates
Lead Free Construction
10.2kV Isolation Package
APPLICATIONS
High Reliability Inverters
Motor Controllers
Traction Drives
Choppers
The Powerline range of high power modules includes
half bridge, chopper, dual, single and bi-directional
switch configurations covering voltages from 1200V to
6500V and currents up to 2400A.
The DIM400XCM33-F000 is a 3300V, soft punch
through n-channel enhancement mode, insulated gate
bipolar transistor (IGBT) chopper module. The IGBT
has a wide reverse bias safe operating area (RBSOA)
plus 10μs short circuit withstand. This device is
optimised for traction drives and other applications
requiring high thermal cycling capability.
The module incorporates an electrically isolated base
plate and low inductance construction enabling circuit
designers to optimise circuit layouts and utilise
grounded heat sinks for safety.
ORDERING INFORMATION
Order As:
DIM400XCM33-F000
Note: When ordering, please use the complete part
number
KEY PARAMETERS
VCES
3300V
VCE(sat) * (typ)
2.8V
IC
(max)
400A
IC(PK)
(max)
800A
* Measured at the auxiliary terminals
Fig. 1 Circuit configuration
Outline type code: X
(See Fig. 11 for further information)
Fig. 2 Package
2(G)
1(E)
6(E)
3(C)
4(K)
5(A)
7(C)


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