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CSD17552Q3A Datasheet(PDF) 1 Page - Texas Instruments |
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CSD17552Q3A Datasheet(HTML) 1 Page - Texas Instruments |
1 / 12 page 0 2 4 6 8 10 12 14 16 18 0 2 4 6 8 10 12 VGS - Gate-to- Source Voltage (V) TC = 25°C Id = 11A TC = 125ºC Id = 11A G001 0 2 4 6 8 10 0 5 10 15 20 Qg - Gate Charge (nC) ID = 11A VDS =15V G001 1 D 2 D 3 D 4 D D 5 G 6 S 7 S 8 S P0093-01 CSD17552Q3A www.ti.com SLPS387 – SEPTEMBER 2012 30V, N-Channel NexFET™ Power MOSFETs Check for Samples: CSD17552Q3A 1 FEATURES PRODUCT SUMMARY • Ultra Low Qg and Qgd VDS Drain to Source Voltage 30 V • Low Thermal Resistance Qg Gate Charge Total (4.5V) 9.0 nC • Avalanche Rated Qgd Gate Charge Gate to Drain 2.3 nC VGS = 4.5V 6.5 m Ω • Pb Free Terminal Plating RDS(on) Drain to Source On Resistance VGS = 10V 5.5 m Ω • RoHS Compliant VGS(th) Threshold Voltage 1.5 V • Halogen Free • SON 3.3-mm × 3.3-mm Plastic Package ORDERING INFORMATION Device Package Media Qty Ship APPLICATIONS SON 3.3-mm × 3.3- 13-Inch Tape and CSD17552Q3A 2500 mm Plastic Package Reel Reel • Point of load Synchronous Buck in Networking, Telecom and Computing Systems ABSOLUTE MAXIMUM RATINGS • Optimized for Control FET Applications TA = 25°C unless otherwise stated VALUE UNIT VDS Drain to Source Voltage 30 V DESCRIPTION VGS Gate to Source Voltage ±20 V The NexFET power MOSFET has been designed to Continuous Drain Current, TC = 25°C 60 A minimize losses in power conversion applications. ID Continuous Drain Current, Silicon Limitted 74 A Figure 1. Top View Continuous Drain Current, TA = 25°C (1) 15 A IDM Pulsed Drain Current, TA = 25°C (2) 84 A PD Power Dissipation(1) 2.6 W TJ, Operating Junction and Storage –55 to 150 °C TSTG Temperature Range Avalanche Energy, single pulse EAS 45 mJ ID = 30A, L = 0.1mH, RG = 25Ω (1) Typical RθJA = 48°C/W on a 1-inch2 (6.45-cm2), 2-oz. (0.071-mm thick) Cu pad on a 0.06-inch (1.52-mm) thick FR4 PCB. (2) Pulse duration ≤300μs, duty cycle ≤2% RDS(on) vs VGS GATE CHARGE 1 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Copyright © 2012, Texas Instruments Incorporated Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. |
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