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DAC16GS Datasheet(PDF) 3 Page - Analog Devices |
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DAC16GS Datasheet(HTML) 3 Page - Analog Devices |
3 / 12 page DAC16 REV. B –3– CAUTION 1. Stresses above those listed under “Absolute Maximum Rat- ings” may cause permanent damage to the device. This is a stress rating only and functional operation at or above this specification is not implied. Exposure to the above maximum rating conditions for extended periods may affect device reliability. 2. Digital inputs and outputs are protected; however, perma- nent damage may occur on unprotected units from high en- ergy electrostatic fields. Keep units in conductive foam or packaging at all times until ready to use. Use proper anti- static handling procedures. 3. Remove power before inserting or removing units from their sockets. PIN CONFIGURATION 24-Lead DIP (P, S) TOP VIEW (Not to Scale) 24 23 22 21 20 19 18 17 16 15 14 13 1 2 3 4 5 6 7 8 9 10 11 12 DAC16 IREF CCOMP DGND VCC DB15 (MSB) DB14 DB13 DB12 DB11 DB10 DB9 DB8 DB7 IOUT AGND REF GND VEE DB0 (LSB) DB1 DB2 DB3 DB4 DB5 DB6 PIN DESCRIPTION Pin (P, S) Name Description 1IREF Reference Current Input 2 DGND Digital Ground 3VCC +5 V Digital Supply 4–19 DB15–DB0 16-Bit Digital Input Bus. DB15 is the MSB. 20 VEE –15 V Analog Supply 21 REF GND Reference Current Return 22 AGND Analog Ground/Output Reference 23 IOUT Current Output 24 CCOMP Current Ladder Compensation ORDERING GUIDE Model Grade DNL (max) Temperature Ranges Package Descriptions Package Options DAC16GS ±10°C to +70°C 24-Lead SOL R-24 DAC16FP ±2 –40 °C to +85°C 24-Lead PDIP N-24 DAC16FS ±2 –40 °C to +85°C 24-Lead SOL R-24 DAC16GBC ±1 +25 °CDie ABSOLUTE MAXIMUM RATINGS (TA = +25°C unless otherwise noted) VCC to VEE . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V, +25.0 V VCC to DGND . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V, +7.0 V VEE to AGND . . . . . . . . . . . . . . . . . . . . . . . . +0.3 V, –18.0 V DGND to AGND . . . . . . . . . . . . . . . . . . . . . . –0.3 V, +0.3 V REF GND to AGND . . . . . . . . . . . . . . . . . . . –0.3 V, +1.0 V IREF . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 mA Analog Output Current . . . . . . . . . . . . . . . . . . . . . . . . . . 8 mA Digital Input Voltage to DGND . . . . . . . . . . . . . . . . . . . ≤V CC Operating Temperature Range FP, FS . . . . . . . . . . . . . . . . . . . . . . . . . . . . –40 °C to +85°C GS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0 °C to +70°C Dice Junction Temperature . . . . . . . . . . . . . . . . . . . . . +150 °C Storage Temperature . . . . . . . . . . . . . . . . . . –65 °C to +150°C Power Dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . 1000 mW Lead Temperature (Soldering, 60 sec) . . . . . . . . . . . . +300 °C Package Type θ JA 1 θ JC Units 24-Lead Plastic DIP (P) 62 32 °C/W 24-Lead Plastic SOL (S) 70 22 °C/W NOTE 1 θ JA is specified for worst case mounting conditions, i.e., θJA is specified for device in socket. DICE CHARACTERISTICS VCC DGND IREF CCOMP IOUT AGND REF GND VEE DB0 (LSB) DB1 DB2 DB3 DB4 DB5 DB6 DB7 DB8 DB9 DB10 DB11 DB12 DB13 DB14 DB15 (MSB) Die Size 0.129 x 0.153 inch, 19,737 sq. mils (3.277 x 3.886 mm, 12.73 sq. mm) The DAC16 Contains 330 Transistors. Substrate is VEE Polarity. |
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