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DRV11873 Datasheet(PDF) 9 Page - Texas Instruments |
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DRV11873 Datasheet(HTML) 9 Page - Texas Instruments |
9 / 16 page DRV11873 www.ti.com SLWS237 – NOVEMBER 2012 APPLICATION INFORMATION DRV11873 only requires 5 external components. A 10-µF or higher ceramic capacitor connected to VCC and ground is needed for decoupling purpose. During layout, the strategy of ground copper pour is very important to enhance the thermal performance. For two or more layers, eight thermal vias are needed. Refer to Figure 1 for an example of PCB layout. For high speed motors (FS = 1), which need higher start up current, three Schottkey diodes are needed between phases U, V, W and ground. Each diode anode terminal needs to be connected to ground and cathode terminal needs to be connected to either U or V or W. Figure 1. PCB Layout Copyright © 2012, Texas Instruments Incorporated Submit Documentation Feedback 9 |
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