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DRV777DR Datasheet(PDF) 5 Page - Texas Instruments |
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DRV777DR Datasheet(HTML) 5 Page - Texas Instruments |
5 / 17 page ( ) J(MAX) A (MAX) JA T T PD - = q N D OLi Li i 1 P V I = = ´ å DRV777 www.ti.com SLRS062 – DECEMBER 2012 APPLICATION INFORMATION TTL and other Logic Inputs DRV777 input interface is specified for standard 1.8V, 3V and 5V CMOS logic interface. Refer to Figure 8 and Figure 9 to establish VOL and the corresponding typical load current levels for various input voltage ranges. Application Information section shows an implementation to drive 1.8V relays using DRV777. Input RC Snubber DRV777 features an input RC snubber that helps prevent spurious switching in noisy environment. Connect an external 1k Ω to 5kΩ resistor in series with the input to further enhance DRV777’s noise tolerance. High-impedance Input Drivers DRV777 features a 300k Ω input pull-down resistor. The presence of this resistor allows the input drivers to be tri- stated. When a high-impedance driver is connected to a channel input the DRV777 detects the channel input as a low level input and remains in the OFF position. The input RC snubber helps improve noise tolerance when input drivers are in the high-impedance state. On-chip Power Dissipation Use the below equation to calculate DRV777 on-chip power dissipation PD: Where: N is the number of channels active together. VOLi is the OUTi pin voltage for the load current ILi. (1) Thermal Reliability It is recommended to limit DRV777 IC’s die junction temperature to less than 125°C. The IC junction temperature is directly proportional to the on-chip power dissipation. Use the following equation to calculate the maximum allowable on-chip power dissipation for a target IC junction temperature: Where: TJ(MAX) is the target maximum junction temperature. TA is the operating ambient temperature. θJA is the package junction to ambient thermal resistance. (2) Improving Package Thermal Performance The package θJA value under standard conditions on a High-K board is listed in the DISSIPATION RATINGS. θJA value depends on the PC board layout. An external heat sink and/or a cooling mechanism, like a cold air fan, can help reduce θJA and thus improve device thermal capabilities. Refer to TI’s design support web page at www.ti.com/thermal for a general guidance on improving device thermal performance. Copyright © 2012, Texas Instruments Incorporated Submit Documentation Feedback 5 Product Folder Links: DRV777 |
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