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DAC08 Datasheet(PDF) 3 Page - Analog Devices

Part No. DAC08
Description  8-Bit, High Speed, Multiplying D/A Converter (Universal Digital Logic Interface)
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DAC08 Datasheet(HTML) 3 Page - Analog Devices

 
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PIN CONNECTIONS
16-Pin Dual-In-Line Package
(Q Suffix)
16-Lead SO
(S Suffix)
DAC08RC/883 20-Lead LCC
(RC Suffix)
NC = NO CONNECT
ABSOLUTE MAXIMUM RATINGS
1
Operating Temperature
DAC08AQ, Q . . . . . . . . . . . . . . . . . . . . . . –55
°C to +125°C
DAC08HQ, EQ, CQ, HP, EP, CP, CS . . . . . 0
°C to +70°C
Junction Temperature (TJ) . . . . . . . . . . . . . . –65
°C to +150°C
Storage Temperature Q Package . . . . . . . . . . –65
°C to +150°C
Storage Temperature P Package . . . . . . . . . . –65
°C to +125°C
Lead Temperature (Soldering, 60 sec) . . . . . . . . . . . . . . 300
°C
V+ Supply to V– Supply . . . . . . . . . . . . . . . . . . . . . . . . . . 36 V
Logic Inputs . . . . . . . . . . . . . . . . . . . . . . . . V– to V– plus 36 V
VLC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . V– to V+
Analog Current Outputs (at VS– = 15 V) . . . . . . . . . . 4.25 mA
Reference Input (V14 to V15) . . . . . . . . . . . . . . . . . . . V– to V+
Reference Input Differential Voltage
(V14 to V15) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
±18 V
Reference Input Current (I14) . . . . . . . . . . . . . . . . . . . 5.0 mA
Package Type
JA
2
JC
Units
16-Pin Hermetic DIP (Q)
100
16
°C/W
16-Pin Plastic DIP (P)
82
39
°C/W
20-Contact LCC (RC)
76
36
°C/W
16-Pin SO (S)
111
35
°C/W
NOTES
1Absolute maximum ratings apply to both DICE and packaged parts, unless
otherwise noted.
2
θ
JA is specified for worst case mounting conditions, i.e., θJA is specified for device
in socket for cerdip, P-DIP, and LCC packages;
θ
JA is specified for device soldered
to printed circuit board for SO package.
ORDERING GUIDE
1
16-Pin Dual-In-Line Package
Operating
Temperature
NL
Hermetic
Plastic
LCC
Range
0.1%
DAC08AQ
2
MIL
DAC08HQ
DAC08HP
COM
0.19%
DAC08Q
2
DAC08RC/883
MIL
DAC08EQ
DAC08EP
COM
0.39%
DAC08CQ
DAC08CP
COM
DAC08CS
3
COM
NOTES
1Burn-in is available on commercial and industrial temperature range parts in
cerdip, plastic DIP, and TO-can packages.
2For devices processed in total compliance to MIL-STD-883, add /883 after
part number. Consult factory for 883 data sheet.
3For availability and burn-in information on SO and PLCC packages, contact
your local sales office.
TYPICAL ELECTRICAL CHARACTERISTICS
All Grades
Parameter
Symbol
Conditions
Typical
Units
Reference Input Slew Rate
dI/dt
8
mA/
µs
Propagation Delay
tPLH, tPHL
TA = 25
°C, Any Bit
35
ns
Settling Time
tS
To +1/2 LSB, All Bits
Switched ON or OFF,
85
ns
TA = 25
°C
NOTES
For DAC08NT & GT 25
°C characteristics, see DAC08N & G characteristics respectively.
Specifications subject to change without notice
(@ VS =
15 V, and IREF = 2.0 mA, unless otherwise noted. Output
characteristics apply to both IOUT and IOUT .)
DAC08
–3–
REV. A


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