Specification: DS-ITC135P-R05

All rights reserved. Printed in USA.

12/19/2012

For additional information please visit our website at: www.ixysic.com

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ITC135P

IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make

changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated

Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its

products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right.

The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other

applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical harm, injury, or death to a person or severe

property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice.

MECHANICAL DIMENSIONS

(inches)

mm

DIMENSIONS

NOTES:

1. Coplanarity = 0.1016 (0.004) max.

2. Leadframe thickness does not include solder plating

(1000 microinch maximum).

3. Sum of package height, standoff, and coplanarity

does not exceed 2.108 (0.083).

8.890 TYP

(0.350 TYP)

0.406 TYP

(0.016 TYP)

10.160±0.381

(0.400±0.015)

7.493±0.127

(0.295±0.005)

10.363±0.127

(0.408±0.005)

1.270 TYP

(0.050 TYP)

0.635 X 45°

(0.025 X 45°)

0.254 ±0.0127

(0.010±0.0005)

1.016 TYP

(0.040 TYP)

0.508±0.1016

(0.020±0.004)

PIN 1

PIN 16

2.108 MAX

(0.083 MAX)

See Note 3

MIN: 0.0254 (0.001)

MAX: 0.102 (0.004)

Lead to Package Standoff:

1.90

(0.075)

1.27

(0.050)

9.30

(0.366)

0.60

(0.024)

PCB Land Pattern

Dimensions

mm

(inches)

Embossment

Embossed Carrier

Top Cover

Tape Thickness

0.102 MAX.

(0.004 MAX.)

330.2 DIA.

(13.00 DIA.)

K

(0.126)

K

(0.106)

A

(0.429)

W=16

(0.630)

B

(0.421)

P=12.00

(0.472)

NOTES:

1. All dimensions carry tolerances of EIA Standard 481-2

2. The tape complies with all “Notes” for constant dimensions

listed on page 5 of EIA-481-2

ITC135P

ITC135PTR Tape & Reel