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September 10,2012-REV.00

P4SMAFJ SERIES

FEATURES

• For surface mounted applications in order to optimize board space.

• Low profile package

• Glass passivated junction

• Low inductance

• Plastic package has Underwriters Laboratory Flammability

Classification 94V-O

• High temperature soldering : 260°C /10 seconds at terminals

• Lead free in comply with EU RoHS 2002/95/EC directives

• Green molding compound as per IEC61249 Std. . (Halogen Free)

MECHANICAL DATA

• Case: SMAF, Plastic

• Terminals:Solder plated,solderable per MIL-STD-750,Method2026

• Polarity: Color band denotes cathode end

• Weight: 0.0011 ounces, 0.0328grams

NOTES:

1. Non-repetitive current pulse, per Fig.3 and derated above T

2. Mounted on FR-4 PCB single-sided copper, mini pad.

3. Peak Forward Surge Current:8.3ms single half sine-wave Superimposed on rated load (JEDEC method).

4. Peak pulse power waveform is 10/1000S.

R AT IN G

SYMBOL

VALUE

U N IT S

400

W

Peak Forward Surge Current (Note 3,Fig 5)

40

A

Peak Pulse Current on 10/1000 us waveform (Note 1, Fig 2)

see Table 1

A

390

pF

ESD Voltage per IEC6100-4-2

Contact

Air

+8

+15

kV

Typical Thermal Resistance Junction to Ambient(Note 2)

150

Operating Junction Temperature and Storage Temperature Range

-55 to +150

SURFACE MOUNT TRANSIENT VOLTAGE SUPPRESSOR POWER 400 Watts

STAND-OFF VOLTAGE

8.5 to 170 Volts

1

2

C a th o d e

A n o d e