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ADDC02815DATV Datasheet(PDF) 11 Page - Analog Devices

Part # ADDC02815DATV
Description  28 V/100 W DC/DC Converters with Integral EMI Filter
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Manufacturer  AD [Analog Devices]
Direct Link  http://www.analog.com
Logo AD - Analog Devices

ADDC02815DATV Datasheet(HTML) 11 Page - Analog Devices

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ADDC02812DA/ADDC02815DA
REV. A
–11–
Input Voltage Transient Protection: The converters have a
transient voltage suppressor connected across their input leads
to protect the units against high voltage pulses (both positive
and negative) of short duration. With the power supply con-
nected in the typical system setup shown in Figure 17, a tran-
sient voltage pulse is created across the converter in the
following manner. A 20
µF capacitor is first charged to 400 V.
It is then connected directly across the converter’s end of the
two meter power lead cable through a 2
Ω on-state resistance
MOSFET. The duration of this connection is 10
µs. The pulse
is repeated every second for 30 minutes. This test is repeated
with the connection of the 20
µF capacitor reversed to create a
negative pulse on the supply leads. (If continuous reverse volt-
age protection is required, a diode can be added externally in
series at the expense of lower efficiency for the power system.)
The converter responds to this input transient voltage test by
shutting down due to its input overvoltage protection feature.
Once the pulse is over, the converter initiates a soft-start, which
is completed before the next pulse. No degradation of converter
performance occurs.
THERMAL CHARACTERISTICS
Junction and Case Temperatures: It is important for the
user to know how hot the hottest semiconductor junctions
within the converter get and to understand the relationship
between junction, case, and ambient temperatures. The hottest
semiconductors in the 100 W product line of Analog Devices’
high density power supplies are the switching MOSFETs and
the output rectifiers. There is an area inside the main power
transformers that is hotter than these semiconductors, but it is
within NAVMAT guidelines and well below the Curie tempera-
ture of the ferrite. (The Curie temperature is the point at which
the ferrite begins to lose its magnetic properties.)
Since NAVMAT guidelines require that the maximum junction
temperature be 110
°C, the power supply manufacturer must
specify the temperature rise above the case for the hottest semi-
conductors so the user can determine what case temperature is
required to meet NAVMAT guidelines. The thermal charac-
teristics section of the specification table states the hottest junc-
tion temperature for maximum output power at a specified case
temperature. The unit can operate to higher case temperatures
than 90
°C, but 90°C is the maximum temperature that permits
NAVMAT guidelines to be met.
Case and Ambient Temperatures: It is the user’s responsi-
bility to properly heat sink the power supply in order to maintain
the appropriate case temperature and, in turn, the maximum
junction temperature. Maintaining the appropriate case tem-
perature is a function of the ambient temperature and the
mechanical heat removal system. The static relationship of
these variables is established by the following formula:
TC = TA + (PD × Rθ
CA
)
where
TC = case temperature measured at the center of the package
bottom,
TA = ambient temperature of the air available for cooling,
PD = the power, in watts, dissipated in the power supply,
Rθ
CA =
the thermal resistance from the center of the package
to free air, or case to ambient.
The power dissipated in the power supply, PD, can be calculated
from the efficiency, h, given in the data sheets and the actual
output power, PO, in the user’s application by the following
formula:
P
D = PO
1
η –1


For example, at 80 W of output power and 80% efficiency, the
power dissipated in the power supply is 20 W. If under these
conditions, the user wants to maintain NAVMAT deratings
(i.e., a case temperature of approximately 90
°C) with an ambi-
ent temperature of 75
°C, the required thermal resistance, case
to ambient, can be calculated as
90 = 75 + (20
× Rθ
CA
) or Rθ
CA
= 0.75
°C/W
This thermal resistance, case to ambient, will determine what
kind of heat sink and whether convection cooling or forced air
cooling is required to meet the constraints of the system.
SYSTEM INSTABILITY CONSIDERATIONS
In a distributed power supply architecture, a power source
provides power to many “point-of-load” (POL) converters. At
low frequencies, the POL converters appear incrementally as
negative resistance loads. This negative resistance could cause
system instability problems.


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