A1-A7

Case: JEDEC SOD-123FL molded plastic body over passivated chip

Terminals: Solderable per MIL-STD-750,

Method 2026

Polarity: Color band denotes cathode end

Mounting Position: Any

Weight:0.006 ounce, 0.02 grams

Glass passivated device

Ideal for surface mouted applications

FEATURES

MECHANICAL DATA

MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS

Metallurgically bonded construction

High temperature soldering guaranteed:

5 lbs. (2.3kg) tension

Low reverse leakage

Note:

3.Thermal resistance from junction to ambient at 0.375

” (9.5mm)lead length,P.C.B. mounted

Ratings at 25 C ambient temperature unless otherwise specified.

Single phase half-wave 60Hz,resistive or inductive load,for capacitive load current derate by 20%.

2.Measured at 1MHz and applied reverse voltage of 4.0V D.C.

1.Averaged over any 20ms period.

SYMBOLS

100

70

100

400

280

400

200

140

200

600

420

600

800

560

800

1.0

25.0

1.1

Operating junction and storage temperature range

Maximum repetitive peak reverse voltage

Maximum RMS voltage

Maximum DC blocking voltage

Maximum average forward rectified current

Peak forward surge current

8.3ms single half sine-wave superimposed on

rated load (JEDEC Method)

Maximum instantaneous forward voltage at 1.0A

Maximum DC reverse current

at rated DC blocking voltage

Typical junction capacitance (NOTE 2)

10.0

50.0

R

180

4

-55 to +150

Typical thermal resistance (NOTE 3)

UNITS

VOLTS

VOLTS

VOLTS

Amp

Amps

Volts

pF

C

A

µ

K/W

A2

50

35

50

A1

1000

700

1000

SOD-123FL

2.8±0.1

Cathode Band

Top View

3.7±0.2

0.6±0.25

Dimensions in millimeters

A3

A4

A5

A6

A7

GAOMI FEI SHI LONG DA ELECTRONICS Co.,Ltd

高　密　飞　仕　龙　达　电　子　有　限　公　司　

星合电子

ＸＩＮＧＨＥ　ＥＬＥＣＴＲＯＮＩＣＳ

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