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AD9002AD Datasheet(PDF) 5 Page - Analog Devices

Part No. AD9002AD
Description  High Speed 8-Bit Monolithic A/D Converter
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Maker  AD [Analog Devices]
Homepage  http://www.analog.com
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AD9002AD Datasheet(HTML) 5 Page - Analog Devices

   
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AD9002
–5–
REV. D
Die Dimensions . . . . . . . . . . . . . . . . . 106
× 114 × 15 (±2) mils
Pad Dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
× 4 mils
Metalization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Gold
Backing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . None
Substrate Potential . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –VS
Passivation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Nitride
Die Attach . . . . . . . . . . . . . . . . . . . . . Gold Eutectic (Ceramic)
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Epoxy (Plastic)
Bond Wire . . . . . . . . . . . . . 1-1.3 mil Gold; Gold Ball Bonding
APERTURE
DELAY
ANALOG
INPUT
ENCODE
OUTPUT
DATA
N
N + 1
N + 2
tPD
N – 1
N + 1
N
Figure 1. Timing Diagram
AD9002
ENCODE
ENCODE
–5.2V
DIGITAL
OUTPUT
+VREF
R
R/2
R/2
R
–VREF
–5.2V
–5.2V
–5.2V
–5.2V
COMPARATOR CELLS
REFMID
ANALOG
INPUT
AD9002
AD9002
Figure 2. Input/Output Circuits
OVERFLOW INH
AD1
AD2
AD3
1k
1k
100
0.1 F
HYSTERESIS
ANALOG IN
ENCODE
ENCODE
–VREF
+VREF
GROUND
D1
D2
D3
D4
D5
D6
D7
D8
OVERFLOW
–5.2V
1k
1k
1k
1k
1k
1k
1k
1k
AD9002
–2V
0.1 F
STATIC BURN IN
DYNAMIC BURN IN
AD1 = 0V
AD2 = ECL HIGH
AD3 = ECL LOW
AD1
AD2
AD3
0V
–2V
ECL HIGH
ECL LOW
ECL HIGH
ECL LOW
ALL RESISTORS
5%,
ALL CAPACITORS
20%,
F
ALL SUPPLIES
5%
–VS
1k
Figure 3. Burn-in Diagram
OVERFLOW
ANALOG
INPUT
ANALOG
GROUND
ENCODE
ENCODE
ANALOG
GROUND
ANALOG
INPUT
–VREF
REFMID
DIGITAL
GROUND DIGITAL
–VS
D1 (LSB)
D2
D3
D4
D5
DIGITAL
GROUND
ANALOG –VS
DIGITAL
GROUND
D6
D7
D8 (MSB)
DIGITAL –VS
DIGITAL
GROUND
OVERFLOW
INHIBIT
HYSTERESIS
+VREF
Figure 4. Die Layout and Mechanical Information


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