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AD8032BN Datasheet(PDF) 5 Page - Analog Devices |
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AD8032BN Datasheet(HTML) 5 Page - Analog Devices |
5 / 16 page AD8031/AD8032 –5– REV. B ORDERING GUIDE Temperature Package Package Brand Model Range Descriptions Options Code AD8031AN –40 °C to +85°C 8-Lead Plastic DIP N-8 AD8031AR –40 °C to +85°C 8-Lead SOIC SO-8 AD8031AR-REEL –40 °C to +85°C 13" Tape and Reel SO-8 AD8031AR-REEL7 –40 °C to +85°C 7" Tape and Reel SO-8 AD8031ART-REEL –40 °C to +85°C 13" Tape and Reel RT-5 H0A AD8031ART-REEL7 –40 °C to +85°C 7" Tape and Reel RT-5 H0A AD8031BN –40 °C to +85°C 8-Lead Plastic DIP N-8 AD8031BR –40 °C to +85°C 8-Lead SOIC SO-8 AD8031BR-REEL –40 °C to +85°C 13" Tape and Reel SO-8 AD8031BR-REEL7 –40 °C to +85°C 7" Tape and Reel SO-8 AD8032AN –40 °C to +85°C 8-Lead Plastic DIP N-8 AD8032AR –40 °C to +85°C 8-Lead SOIC SO-8 AD8032AR-REEL –40 °C to +85°C 13" Tape and Reel SO-8 AD8032AR-REEL7 –40 °C to +85°C 7" Tape and Reel SO-8 AD8032ARM –40 °C to +85°C 8-Lead µSOIC RM-8 H9A AD8032ARM-REEL –40 °C to +85°C 13" Tape and Reel RM-8 H9A AD8032ARM-REEL7 –40 °C to +85°C 7" Tape and Reel RM-8 H9A AD8032BN –40 °C to +85°C 8-Lead Plastic DIP N-8 AD8032BR –40 °C to +85°C 8-Lead SOIC SO-8 AD8032BR-REEL –40 °C to +85°C 13" Tape and Reel SO-8 AD8032BR-REEL7 –40 °C to +85°C 7" Tape and Reel SO-8 ABSOLUTE MAXIMUM RATINGS 1 Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +12.6 V Internal Power Dissipation 2 Plastic DIP Package (N) . . . . . . . . . . . . . . . . . . . 1.3 Watts Small Outline Package (R) . . . . . . . . . . . . . . . . . . 0.8 Watts µSOIC (RM) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.6 Watts SOT-23-5 (RT) . . . . . . . . . . . . . . . . . . . . . . . . . . 0.5 Watts Input Voltage (Common-Mode) . . . . . . . . . . . . . ±V S ± 0.5 V Differential Input Voltage . . . . . . . . . . . . . . . . . . . . . . . ±3.4 V Output Short Circuit Duration . . . . . . . . . . . . . . . . . . . . . . Observe Power Derating Curves Storage Temperature Range (N, R, RM, RT) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –65 °C to +125°C Lead Temperature Range (Soldering 10 sec) . . . . . . . . +300 °C NOTES 1Stresses above those listed under Absolute Maximum Ratings may cause perma- nent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. 2Specification is for the device in free air: 8-Lead Plastic DIP Package: θ JA = 90°C/W. 8-Lead SOIC Package: θ JA = 155°C/W. 8-Lead µSOIC Package: θ JA = 200°C/W. 5-Lead SOT-23-5 Package: θ JA = 240°C/W. MAXIMUM POWER DISSIPATION The maximum power that can be safely dissipated by the AD8031/AD8032 are limited by the associated rise in junction temperature. The maximum safe junction temperature for plas- tic encapsulated devices is determined by the glass transition temperature of the plastic, approximately +150 °C. Exceeding this limit temporarily may cause a shift in parametric perfor- mance due to a change in the stresses exerted on the die by the package. Exceeding a junction temperature of +175 °C for an extended period can result in device failure. While the AD8031/AD8032 are internally short circuit pro- tected, this may not be sufficient to guarantee that the maxi- mum junction temperature (+150 °C) is not exceeded under all conditions. To ensure proper operation, it is necessary to observe the maximum power derating curves shown in Figure 2. AMBIENT TEMPERATURE – C 2.0 1.5 0 –50 80 –40 –30 –20 –10 0 10 20 30 40 50 60 70 1.0 0.5 90 TJ = +150 C 8-LEAD SOIC PACKAGE 8-LEAD SOIC SOT-23-5 8-LEAD PLASTIC DIP PACKAGE Figure 2. Maximum Power Dissipation vs. Temperature CAUTION ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the human body and test equipment and can discharge without detection. Although the AD8031/AD8032 feature proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of functionality. WARNING! ESD SENSITIVE DEVICE |
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