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IB054Q096T64N1-00 Datasheet(PDF) 11 Page - Vicor Corporation |
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IB054Q096T64N1-00 Datasheet(HTML) 11 Page - Vicor Corporation |
11 / 14 page IB054Q096T64N1-00 IBC MODULE Rev 1.3 vicorpower.com Page 11 of 14 11/2012 800 735.6200 Parallel Operation The IBC will inherently current share when operated in an array. Arrays may be used for higher power or redundancy in an application. Current sharing accuracy is maximized when the source and load impedance presented to each IBC within an array are equal. The recommended method to achieve matched impedances is to dedicate common copper planes within the PCB to deliver and return the current to the array, rather than rely upon traces of varying lengths. In typical applications the current being delivered to the load is larger than that sourced from the input, allowing narrower traces to be utilized on the input side if necessary. The use of dedicated power planes is, however, preferable. One or more IBCs in an array may be disabled without adversely affecting operation or reliability as long as the load does not exceed the rated power of the enabled IBCs. The IBC power train and control architecture allow bi-directional power transfer, including reverse power processing from the IBC output to its input. The IBC’s ability to process power in reverse improves the IBC tran- sient response to an output load dump. Thermal Considerations The temperature distribution of the VI Brick can vary significantly with its input/ output operating conditions, thermal management and environmental conditions. Although the PCB is UL rated to 130 °C, it is recommended that PCB temperatures be maintained at or below 125 °C. For maximum long term reliability, lower PCB temperatures are recommended for continuous operation, however, short periods of operation at 125 °C will not negatively impact performance or reliability. WARNING: Thermal and voltage hazards. The IBC can operate with surface temperatures and operating voltages that may be hazardous to personnel. Ensure that adequate protection is in place to avoid inadvertent contact. Input Impedance Recommendations To take full advantage of the IBC capabilities, the impedance presented to its input terminals must be low from DC to approximately 5 MHz. The source should exhibit low inductance and should have a critically damped response. If the interconnect inductance is excessive, the IBC input pins should be bypassed with an RC damper (e.g., 47 μFinserieswith 0.3 Ω)toretainlowsourceimpedanceandproperoperation.Giventhe wide bandwidth of the IBC, the source response is generally the limiting factor in the overall system response. Anomalies in the response of the source will appear at the output of the IBC multiplied by its K factor. The DC resistance of the source should be kept as low as possible to minimize voltage deviations. This is especially important if the IBC is operated near low or high line as the overvoltage / undervoltage detection circuitry could be activated. Input Fuse Recommendations The IBC is not internally fused in order to provide flexibility in configuring power systems. However, input line fusing of VI Bricks must always be incorporated within the power system. A fast acting fuse should be placed in series with the +In port. See safety agency approvals. Application Notes For IBC and VI Brick application notes on soldering, thermal management, board layout, and system design visit vicorpower.com. APPLICATIONS NOTE Product Input Package Nominal Temperature Output Enable Pin Options Family Voltage Output Voltage Grade Current Logic Length IB 054 Q 096 T 64 N = Negative 1 = 0.145 -00 = Open frame P = Positive 2 = 0.210 -BP = Baseplate* 3 = 0.180 PART NUMBERING *For baseplate option please contact the factory for availability. |
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