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AD7801BR Datasheet(PDF) 3 Page - Analog Devices |
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AD7801BR Datasheet(HTML) 3 Page - Analog Devices |
3 / 16 page AD7801 –3– REV. 0 TIMING CHARACTERISTICS 1, 2 Limit at TMIN, TMAX Parameter (B Version) Units Conditions/Comments t1 0 ns min Chip Select to Write Setup Time t2 0 ns min Chip Select to Write Hold Time t3 20 ns min Write Pulse Width t4 15 ns min Data Setup Time t5 4.5 ns min Data Hold Time t6 20 ns min Write to LDAC Setup Time t7 20 ns min LDAC Pulse Width t8 20 ns min CLR Pulse Width NOTES 1Sample tested at +25 °C to ensure compliance. All input signals are specified with tr = tf = 5 ns (10% to 90% of V DD) and timed from a voltage level of (VIL + VIH)/2. tr and tf should not exceed 1 µs on any digital input. 2See Figure 1. WARNING! ESD SENSITIVE DEVICE CAUTION ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the human body and test equipment and can discharge without detection. Although the AD7801 features proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of functionality. ABSOLUTE MAXIMUM RATINGS* (TA = +25°C unless otherwise noted) VDD to GND . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +7 V Reference Input Voltage to AGND . . . . –0.3 V to VDD + 0.3 V Digital Input Voltage to DGND . . . . . . –0.3 V to VDD + 0.3 V AGND to DGND . . . . . . . . . . . . . . . . . . . . . –0.3 V to +0.3 V VOUT to AGND . . . . . . . . . . . . . . . . . . –0.3 V to VDD + 0.3 V Operating Temperature Range Commercial (B Version) . . . . . . . . . . . . . –40 °C to +105°C Storage Temperature Range . . . . . . . . . . . . –65 °C to +150°C Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . +150 °C SSOP Package, Power Dissipation . . . . . . . . . . . . . . . 700 mW θ JA Thermal Impedance . . . . . . . . . . . . . . . . . . . . 143 °C/W Lead Temperature, Soldering Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . . +215 °C Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . +220 °C SOIC Package, Power Dissipation . . . . . . . . . . . . . . . 870 mW θ JA Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 74 °C/W Lead Temperature, Soldering Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . . +215 °C Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . +220 °C *Stresses above those listed under Absolute Maximum Ratings may cause perma- nent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those listed in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. ORDERING GUIDE Temperature Package Model Range Option* AD7801BR –40 °C to +105°C R-20 AD7801BRU –40 °C to +105°C RU-20 *R = Small Outline; RU = Thin Shrink Small Outline. (VDD = +2.7 V to +5.5 V; GND = 0 V; Internal VDD/2 Reference. All specifications TMIN to TMAX unless otherwise noted.) |
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