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AD7706 Datasheet(PDF) 5 Page - Analog Devices |
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AD7706 Datasheet(HTML) 5 Page - Analog Devices |
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5 / 32 page  AD7705/AD7706 –5– REV. A ABSOLUTE MAXIMUM RATINGS* (TA = +25°C unless otherwise noted) VDD to GND . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +7 V Analog Input Voltage to GND . . . . . . . . –0.3 V to VDD + 0.3 V Reference Input Voltage to GND . . . . . –0.3 V to VDD + 0.3 V Digital Input Voltage to GND . . . . . . . . –0.3 V to VDD + 0.3 V Digital Output Voltage to GND . . . . . . –0.3 V to VDD + 0.3 V Operating Temperature Range Commercial (B Version) . . . . . . . . . . . . . . –40 °C to +85°C Storage Temperature Range . . . . . . . . . . . . –65 °C to +150°C Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . +150 °C Plastic DIP Package, Power Dissipation . . . . . . . . . . 450 mW θ JA Thermal Impedance . . . . . . . . . . . . . . . . . . . . 105 °C/W Lead Temperature, (Soldering, 10 sec) . . . . . . . . . . +260 °C SOIC Package, Power Dissipation . . . . . . . . . . . . . . . 450 mW θ JA Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 75 °C/W Lead Temperature, Soldering Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . +215 °C Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . +220 °C SSOP Package, Power Dissipation . . . . . . . . . . . . . . . 450 mW θ JA Thermal Impedance . . . . . . . . . . . . . . . . . . . . 139 °C/W Lead Temperature, Soldering Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . +215 °C Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . +220 °C ESD Rating . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . >4000 V *Stresses above those listed under Absolute Maximum Ratings may cause perma- nent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. ORDERING GUIDE VDD Temperature Package Package Model Supply Range Description Options AD7705BN 2.7 V to 5.25 V –40 °C to +85°C Plastic DIP N-16 AD7705BR 2.7 V to 5.25 V –40 °C to +85°C SOIC R-16 AD7705BRU 2.7 V to 5.25 V –40 °C to +85°C TSSOP RU-16 EVAL-AD7705EB Evaluation Board AD7706BN 2.7 V to 5.25 V –40 °C to +85°C Plastic DIP N-16 AD7706BR 2.7 V to 5.25 V –40 °C to +85°C SOIC R-16 AD7706BRU 2.7 V to 5.25 V –40 °C to +85°C TSSOP RU-16 EVAL-AD7706EB Evaluation Board |
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