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TQP519021 Datasheet(PDF) 13 Page - TriQuint Semiconductor

Part No. TQP519021
Description  680-920 MHz High IP3 Dual Channel Downconverter
Download  14 Pages
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Maker  TRIQUINT [TriQuint Semiconductor]
Homepage  http://www.triquint.com
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TQP519021 Datasheet(HTML) 13 Page - TriQuint Semiconductor

 
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TQP519021
680-920 MHz High IP3 Dual Channel Downconverter
Data Sheet: Rev C 12/20/2012
- 13 of 14 -
Disclaimer: Subject to change without notice
© 2012 TriQuint Semiconductor, Inc.
Connecting the Digital World to the Global Network®
PCB Mounting Pattern
NOTES:
1. All dimensions are in millimeters. Angles are in degrees.
2. Use 1 oz. copper minimum for top and bottom layer metal.
3. Vias are required under the backside paddle of this device for proper RF/DC grounding and thermal dissipation. We
recommend a 0.35mm (#80/.0135") diameter bit for drilling via holes and a final plated thru diameter of 0.25 mm (0.10”).
4. Ensure good package backside paddle solder attach for reliable operation and best electrical performance.
Mechanical Information
Package Marking and Dimensions
Marking: Part number – TQP519021
Year, week, country code - YYWW CCCC
Assembly code – AaXXXX
.10 C
2X
.10 C
2X
(1X) shape
0.10
C A B
(36X) 0.400x X 0.250y
0.10
C A B
GND/THERMAL PAD
.10 C
.08 C
SEATING PLANE
36X
6.0±0.1
6.0±0.1
1.85
1.85
5.40
36X 0.10
1.85
1.85
1.02±0.08
C
0.50
36X 0.50 Pitch
0.50
TERMINAL #1
IDENTIFIER
TERMINAL #1
IDENTIFIER
4
5
5
5.40
Notes:
1.
All dimensions are in millimeters. Angles are in degrees.
2.
Except where noted, this part outline conforms to JEDEC standard MO-270, Issue B (Variation DAE) for extra thin profile, fine pitch,
internal stacking module (ISM).
3.
Dimension and tolerance formats conform to ASME Y14.4M-1994.
4.
The contact pin numbering convention and pin 1 identifier conform to JESD 95-1 SPP-012.
5.
Co-planarity applies to the exposed ground/thermal pad as well as the contact pins.
TQP519021
YYWW CCCC
AaXXXX


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