TQP3M9007

¼W High Linearity LNA Gain Block

Data Sheet: Rev D 12/27/11

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Disclaimer: Subject to change without notice

© 2011 TriQuint Semiconductor, Inc.

Connecting the Digital World to the Global Network

®

Mechanical Information

Package Information and Dimensions

Markings:

Part number: 3M9007

Assembly code: ‘Y’ is last digit of part

manufacture year. ‘XXX’ is lot code.

PCB Mounting Pattern

All dimensions are in millimeters (inches). Angles are in degrees.

Notes:

1. Ground / thermal vias are critical for the proper performance of this device. Vias should use a .35mm (#80 / .0135”)

diameter drill and have a final plated thru diameter of .25 mm (.010”).

2. Add as much copper as possible to inner and outer layers near the part to ensure optimal thermal performance.

3. RF trace width depends upon the PC board material and construction.

4. Use 1 oz. Copper minimum.

3M9007

YXXX