TQM8M9076

0.05-4 GHz Digital Variable Gain Amplifier

Datasheet: Rev. D 01-20-12

- 9 of 11 -

Disclaimer: Subject to change without notice

© 2012 TriQuint Semiconductor, Inc.

Connecting the Digital World to the Global

Mechanical Information

Package Information & Dimensions

Marking: Part number - TQM8M9076

Year, week, country code - YYWW CCCC

Assembly code – AaXXXX

PCB Mounting Pattern

2X

32X

SEATING PLANE

5.0±0.1

5.0±0.1

1.90

1.90

1.90

1.90

4.50

1.02±0.08

2X

0.25

32X 0.50 Pitch

C

0.25

5

TERMINAL #1

IDENTIFIER

(32X) 0.450x X 0.240y

0.10

C A B

TERMINAL #1

IDENTIFIER

4

GND/THERMAL PAD

0.20

5

4.50

(1X) shape

0.10

C A B

32X 0.10

.10 C

.10 C

.10 C

.08 C

TQM8M9076

YYWW CCC

AaXXXX

NOTES:

1. All dimensions are in millimeters. Angles are in degrees.

2. Except where noted, this part outline conforms to JEDEC standard MO-270, Issue B

(Variation DAE) for extra thin profile, fine pitch, internal stacking module (ISM).

3. Dimension and tolerance formats conform to ASME Y14.4M-1994.

4. The terminal #1 identifier and terminal numbering conform to JESD 95-1 SPP-012.

5. Co-planarity applies to the exposed ground/thermal pad as well as the contact pins.

6. Contact plating: Electrolytic plated Au over Ni

NOTES:

1. All dimensions are in millimeters. Angles are in degrees.

2. Use 1 oz. copper minimum for top and bottom layer metal.

3. Vias are required under the backside paddle of this device for proper RF/DC grounding and thermal dissipation.

We recommend a 0.35mm (#80/.0135") diameter bit for drilling via holes and a final plated thru diameter of 0.25mm (0.10”).

4. Ensure good package backside paddle solder attach for reliable operation and best electrical performance.

5. Place mounting screws near the part to fasten a back side heat sink.

6. Do not apply solder mask to the back side of the PC board in the heat sink contact region.

7. Ensure that the backside via region makes good physical contact with the heat sink.

COMPONENT SIDE

28X 0.75

0.50 PITCH

3.70

3.70

0.12

28X 0.28

25X

PACKAGE

OUTLINE

0.66

0.76

0.38

3

1