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LP5907MFX-1.2-NOPB Datasheet(PDF) 3 Page - Texas Instruments |
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LP5907MFX-1.2-NOPB Datasheet(HTML) 3 Page - Texas Instruments |
3 / 21 page LP5907 www.ti.com SNVS798D – APRIL 2012 – REVISED NOVEMBER 2012 ABSOLUTE MAXIMUM RATINGS (1) (2) (3) over operating free-air temperature range (unless otherwise noted) MIN MAX UNIT VIN Input voltage –0.3 6 V VOUT Output voltage –0.3 to (VIN + 0.3 V) 6 V VEN Enable input voltage –0.3 to (VIN + 0.3 V) 6 V Continuous power dissipation(3) Internally Limited Junction temperature (TJMAX) 150 °C Storage temperature range –65 150 °C Maximum lead temperature (soldering, 10 seconds) 260 °C Human body model 2 kV ESD rating(4) Machine model 200 V (1) If Military or Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and specifications. (2) Absolute Maximum Ratings indicate limits beyond which damage to the component may occur. Operating Ratings are conditions under which operation of the device is guaranteed. Operating Ratings do not imply guaranteed performance limits. For guaranteed performance limits and associated test conditions, see the Electrical Characteristics tables. (3) Internal thermal shutdown circuitry protects the device from permanent damage. (4) The Human body model is a 100 pF capacitor discharged through a 1.5 k Ω resistor into each pin. The machine model is a 200 pF capacitor discharged directly into each pin. MIL-STD-883 3015.7 OPERATING RATINGS (1) (2) over operating free-air temperature range (unless otherwise noted) MIN NOM MAX UNIT VIN Input voltage range 2.2 5.5 V VEN Enable voltage range 0 to (VIN + 0.3) 5.5 V Recommended load current(3) 0 250 mA TJ Junction temperature range –40 +125 °C TA Ambient temperature range(3) –40 +85 °C (1) Absolute Maximum Ratings indicate limits beyond which damage to the component may occur. Operating Ratings are conditions under which operation of the device is guaranteed. Operating Ratings do not imply guaranteed performance limits. For guaranteed performance limits and associated test conditions, see the Electrical Characteristics tables. (2) All voltages are with respect to the potential at the GND pin. (3) In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may have to be derated. Maximum ambient temperature (TA-MAX) is dependent on the maximum operating junction temperature (TJ-MAX-OP = 125°C), the maximum power dissipation of the device in the application (PD-MAX), and the junction-to ambient thermal resistance of the part/package in the application ( θJA), as given by the following equation: TA-MAX = TJ-MAX-OP – (θJA × PD-MAX). See applications section. THERMAL CHARACTERISTICS over operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT Micro SMD 119.6 JEDEC board(2) Junction to ambient thermal θJA SOT23 188.8 °C/W resistance(1) 4L cellphone board (micro SMD) 186.5 (1) Junction-to-ambient thermal resistance is highly application and board-layout dependent. In applications where high maximum power dissipation exists, special care must be paid to thermal dissipation issues in board design. (2) Detailed description of the board can be found in JESD51-7 Copyright © 2012, Texas Instruments Incorporated Submit Documentation Feedback 3 Product Folder Links: LP5907 |
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