KEMET Electronics Corporation, P.O. Box 5928, Greenville, S.C. 29606, (864) 963-6300

49

KEMET

®

CERAMIC CHIP CAPACITORS

C 0805 C 103 K

5 R

A C*

CERAMIC

SIZE CODE

SPECIFICATION

C - Standard

CAPACITANCE CODE

Expressed in Picofarads (pF)

First two digits represent significant figures.

Third digit specifies number of zeros. (Use 9

for 1.0 through 9.9pF. Use 8 for 0.5 through 0.99pF)

(Example: 2.2pF = 229 or 0.50 pF = 508)

CAPACITANCE TOLERANCE

B – ±0.10pF

J – ±5%

C – ±0.25pF

K – ±10%

D – ±0.5pF

M – ±20%

F – ±1%

P – (GMV) – special order only

G – ±2%

Z – +80%, -20%

L #

W #

B

S

MOUNTING

LENGTH

WIDTH

BANDWIDTH

MIN. SEPARATION

TECHNIQUE

1.0 (.04) ± .05(.002)

0.5 (.02) ± .05 (.002)

0.20 (0.008)-0.40 (0.016)

0.3 (.012)

Solder Reflow

1.6 (.063) ± 0.15 (.006)

0.8 (.032) ± 0.15 (.006)

0.35 (.014) ±0.15 (.006)

0.7 (.028)

2.0 (.079) ± 0.2 (.008)

1.25 (.049) ± 0.2 (.008)

0.5 (.02) ±.25 (.010)

0.75 (.030)

Solder Wave †

3.2 (.126) ± 0.2 (.008)

1.6 (.063) ± 0.2 (.008)

0.5 (.02) ±.25 (.010)

N/A

Solder Reflow

3.2 (.126) ± 0.2 (.008)

2.5 (.098) ± 0.2 (.008)

0.5 (.02) ±.25 (.010)

N/A

4.5 (.177) ± 0.3 (.012)

3.2 (.126) ± 0.3 (.012)

0.6 (.024) ±.35 (.014)

N/A

4.5 (.177) ± 0.3 (.012)

6.4 (.252) ± 0.4 (.016)

0.6 (.024) ±.35 (.014)

N/A

5.6 (.220) ± 0.4 (.016)

5.0 (.197) ± 0.4 (.016)

0.6 (.024) ±.35 (.014)

N/A

5.6 (.220) ± 0.4 (.016)

6.3 (.248) ± 0.4 (.016)

0.6 (.024) ±.35 (.014)

N/A

DIMENSIONS—MILLIMETERS AND (INCHES)

CAPACITOR ORDERING INFORMATION

• C0G (NP0), X7R, X5R, Z5U and Y5V Dielectrics

• 10, 16, 25, 50, 100 and 200 Volts

• Standard End Metalization: Tin-plate over nickel

barrier

• Available Capacitance Tolerances: ±0.10 pF; ±0.25

pF; ±0.5 pF; ±1%; ±2%; ±5%; ±10%; ±20%; and

+80%-20%

• Tape and reel packaging per EIA481-1. (See page

61 for specific tape and reel information.) Bulk

Cassette packaging (0402, 0603, 0805 only) per

IEC60286-6 and EIAJ 7201.

FEATURES

CAPACITOR OUTLINE DRAWINGS

END METALLIZATION

C-Standard

(Tin-plated nickel barrier)

FAILURE RATE LEVEL

A- Not Applicable

TEMPERATURE CHARACTERISTIC

Designated by Capacitance

Change Over Temperature Range

G – C0G (NP0) (±30 PPM/°C)

R – X7R (±15%) (-55°C + 125°C)

P– X5R (±15%) (-55°C + 85°C)

U – Z5U (+22%, -56%) (+10°C + 85°C)

V – Y5V (+22%, -82%) (-30°C + 85°C)

VOLTAGE

1 - 100V

3 - 25V

2 - 200V

4 - 16V

5 - 50V

8 - 10V

W

L

T

B

S

TIN PLATE

NICKEL PLATE

CONDUCTIVE

METALLIZATION

ELECTRODES

* Part Number Example: C0805C103K5RAC

(14 digits - no spaces)

* Note: Indicates EIA Preferred Case Sizes (Tightened tolerances apply for 0402, 0603, and 0805 packaged in bulk cassette, see page 65.)

#Note: These thicknesses are EIA maximums. Most chips are considerably thinner. Consult factory for details. Also, some extended values may be slightly thicker than EIA maximums.

† For extended value 1210 case size – solder reflow only.

or

Solder

Reflow

METRIC

SIZE CODE

(Ref only)

1005

1608

2012

3216

3225

4532

4564

5650

5664

EIA

SIZE CODE

0402*

0603*

0805*

1206*

1210*

1812

1825*

2220

2225

(Standard Chips - For

Military see page 55)

9 - 6.3V

See pages

48-52 for

thickness

dimensions.