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FPF1038UCX Datasheet(PDF) 2 Page - Fairchild Semiconductor |
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FPF1038UCX Datasheet(HTML) 2 Page - Fairchild Semiconductor |
2 / 3 page © 2010 Fairchild Semiconductor Corporation www.fairchildsemi.com FPF1038 • Rev. 1.0.5 11 Physical Dimensions Figure 30. 6 Ball, 1.0 x 1.5 mm Wafer-Level Chip-Scale Packaging (WLCSP) Nominal Values Bump Pitch Overall Package Height Silicon Thickness Solder Bump Height Solder Bump Diameter 0.5 mm 0.582 mm 0.332 mm 0.250 mm 0.315 mm Product-Specific Dimensions Product D E X Y FPF1038UCX 1.5 mm ±0.03 1.0 mm ±0.03 0.240 mm 0.240 mm Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically the warranty therein, which covers Fairchild products. Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings: http://www.fairchildsemi.com/packaging/. BOTTOM VIEW SIDE VIEWS RECOMMENDED LAND PATTERN BALL A1 INDEX AREA SEATING PLANE A1 F (NSMD PAD TYPE) (Ø0.350) SOLDER MASK OPENING (X) ±0.018 (Y) ±0.018 (Ø0.250) Cu Pad 0.06 C 0.05 C E D F NOTES: A. NO JEDEC REGISTRATION APPLIES. B. DIMENSIONS ARE IN MILLIMETERS. C. DIMENSIONS AND TOLERANCE PER ASMEY14.5M, 1994. D. DATUM C IS DEFINED BY THE SPHERICAL CROWNS OF THE BALLS. E. PACKAGE NOMINAL HEIGHT IS 582 MICRONS ±43 MICRONS (539-625 MICRONS). F. FOR DIMENSIONS D, E, X, AND Y SEE PRODUCT DATASHEET. G. DRAWING FILNAME: MKT-UC006AFrev2. 0.03 C 2X 0.03 C 2X Ø0.315 +/- .025 6X 1 2 A B C 0.332±0.018 0.250±0.025 D E (1.00) (0.50) 0.005 CA B 0.50 0.50 1.00 0.625 0.539 TOP VIEW B A C |
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