RT9198-15PBR datasheet(9/12 Pages) RICHTEK

Part #	RT9198-15PBR

Description	300mA, Thermal Folded Back CMOS LDO Regulator

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Manufacturer	RICHTEK [Richtek Technology Corporation]

Direct Link	http://www.richtek.com

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RT9198T

9

DS9198T-04 April 2011

www.richtek.com

Figure 3. Derating Curve for Packages

For continuous operation, do not exceed absolute

maximum operation junction temperature 125

°C. The

power dissipation definition in device is :

PD = (VIN

− VOUT) x IOUT + VIN x IQ

The maximum power dissipation depends on the thermal

resistance of IC package, PCB layout, the rate of

surroundings airflow and temperature difference between

junction to ambient. The maximum power dissipation can

be calculated by following formula :

PD(MAX) = ( TJ(MAX) - TA ) /

θJA

Where TJ(MAX) is the maximum operation junction

temperature 125

°C, TAis the ambient temperature and the

θJA is the junction to ambient thermal resistance.

For recommended operating conditions specification of

RT9198T, where TJ(MAX) is the maximum junction

temperature of the die (125

°C) and TA is the maximum

ambient temperature. The junction to ambient thermal

resistance (

θJA is layout dependent) for SC-70 package is

333

°C/W, 250°C/W is for SOT-23-3 and SOT-23-5 package

on standard JEDEC 51-3 thermal test board. The

maximum power dissipation at TA = 25

°C can be calculated

by following formula :

PD(MAX) = (125

°C−25°C)/250 = 400 mW (SOT-23-3/

SOT-23-5)

PD(MAX) = (125

°C−25°C)/333 = 300 mW (SC-70-5)

The maximum power dissipation depends on operating

ambient temperature for fixed TJ(MAX) and thermal

resistance

θJA. For RT9198T packages, the Figure 3. of

derating curves allows the designer to see the effect of

rising ambient temperature on the maximum power

allowed.

0

50

100

150

200

250

300

350

400

450

0

25

50

75

100

125

Ambient Temperature (°C )

SOT-23-3, SOT-23-5

SC 70-5

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RT9198-15PBR Datasheet(PDF) 9 Page - Richtek Technology Corporation

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