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RT9013-27PB Datasheet(PDF) 8 Page - Richtek Technology Corporation

Part # RT9013-27PB
Description  300mA, Low Dropout, Low Noise Ultra-Fast Without Bypass Capacitor CMOS LDO Regulator
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Manufacturer  RICHTEK [Richtek Technology Corporation]
Direct Link  http://www.richtek.com
Logo RICHTEK - Richtek Technology Corporation

RT9013-27PB Datasheet(HTML) 8 Page - Richtek Technology Corporation

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RT9013B
8
DS9013B-02 April 2011
www.richtek.com
Figure 2. Derating Curves for RT9013B Packages
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0
25
50
75
100
125
Ambient Temperature (°C)
junction to ambient. The maximum power dissipation can
be calculated by following formula :
PD(MAX) = ( TJ(MAX)
− TA ) /θJA
Where TJ(MAX) is the maximum operation junction
temperature, TA is the ambient temperature and the
θJA is
the junction to ambient thermal resistance.
For recommended operating conditions specification of the
RT9013B, where TJ(MAX) is the maximum junction
temperature of the die (125
°C) and TA is the operated
ambient temperature. The junction to ambient thermal
resistance for SC-70-5 package is 333
°C/W and
WDFN-6L 1.6x1.6 package is 165
°C/W on the standard
JEDEC 51-3 single-layer thermal test board. The maximum
power dissipation at TA = 25
°C can be calculated by
following formula :
PD(MAX) = (125
°C − 25°C) / (333°C/W) = 0.3W for SC-70-5
packages
PD(MAX) = (125
°C − 25°C) / (165°C/W) = 0.606W for
WDFN-6L 1.6x1.6 packages
The maximum power dissipation depends on operating
ambient temperature for fixed TJ(MAX) and thermal resistance
θJA. For RT9013B packages, the Figure 2 of derating curves
allows the designer to see the effect of rising ambient
temperature on the maximum power allowed.
(
°C)
Single Layer PCB
SC-70-5
WDFN-6L 1.6x1.6


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