0

300

0

50

100

150

200

Case Temperature ( C)

o

200

350

100

250

150

50

VCC1 =

= 3.6 V

VCC2

VCC1 =

= 5.5 V

VCC2

ISO1540

ISO1541

www.ti.com

SLLSEB6A – JULY 2012 – REVISED OCTOBER 2012

Table 4. IEC 60664-1 RATINGS TABLE

PARAMETER

TEST CONDITIONS

SPECIFICATION

Basic isolation group

Material group

II

Rated mains voltage

I–IV

Installation classification

Rated mains voltage

I–III

Rated mains voltage

I–II

Table 5. REGULATORY INFORMATION

VDE

CSA

UL

Certified according to DIN EN 60747-5-2

Approved under CSA Component Acceptance Notice

Recognized under UL 1577

(VDE 0884 Part 2) and EN 61010-1

5A, CSA/IEC 60950-1 and CSA/IEC 61010-1

Component Recognition Program

Basic insulation per CSA 60950-1-07 and IEC 60950-1

Basic Insulation

Basic insulation per CSA 61010-1-04 and IEC 61010-1

Single Protection Isolation Voltage,

(1)

Reinforced insulation per CSA 61010-1-04 and IEC

voltage

File number: 40016131 (pending)

File number: 220991

File number: E181974

(1)

Production tested

IEC SAFETY LIMITING VALUES

Safety limiting intends to prevent potential damage to the isolation barrier upon failure of input or output circuitry.

A failure of the IO can allow low resistance to ground or the supply and, without current limiting, dissipate

sufficient power to overheat the die and damage the isolation barrier potentially leading to secondary system

failures.

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

198

Safety input, output, or supply

D-8

mA

current

303

Maximum case temperature

150

°C

The safety-limiting constraint is the absolute maximum junction temperature specified in the absolute maximum

ratings table. The power dissipation and junction-to-air thermal impedance of the device installed in the

application hardware determines the junction temperature. The assumed junction-to-air thermal resistance in the

Thermal Information table is that of a device installed on a High-K Test Board for Leaded Surface Mount

Packages. The power is the recommended maximum input voltage times the current. The junction temperature is

then the ambient temperature plus the power times the junction-to-air thermal resistance.

ISO154x THERMAL DERATING

Figure 5.

Copyright © 2012, Texas Instruments Incorporated

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