© 2012 Fairchild Semiconductor Corporation

www.fairchildsemi.com

FAN7390A Rev. 1.0.0

4

Absolute Maximum Ratings

Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be opera-

ble above the recommended operating conditions and stressing the parts to these levels is not recommended. In addi-

tion, extended exposure to stresses above the recommended operating conditions may affect device reliability. The

Notes:

1. Mounted on 76.2 x 114.3 x 1.6 mm PCB (FR-4 glass epoxy material).

2. Refer to the following standards:

JESD51-2: Integral circuits thermal test method environmental conditions - natural convection; and

JESD51-3: Low effective thermal conductivity test board for leaded surface mount packages.

Recommended Operating Conditions

The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended

operating conditions are specified to ensure optimal performance to the datasheet specifications. Fairchild does not

recommend exceeding them or designing to absolute maximum ratings.

Symbol

Characteristics

Min.

Max.

Unit

High-Side Floating Supply Offset Voltage

V

High-Side Floating Supply Voltage

-0.3

625.0

V

High-Side Floating Output Voltage, HO Pin

V

Low-Side and Logic Fixed Supply Voltage

-0.3

V

Low-Side Output Voltage, LO Pin

-0.3

V

Logic Input Voltage (HIN and LIN)

V

Logic Ground

V

Allowable Offset Voltage Slew Rate

50

V/ns

(1)(2)(3)

Power Dissipation

1.0

W



JA

Thermal Resistance, Junction-to-Ambient

110

C/W

Junction Temperature

+150

C

Storage Temperature

+150

C

Symbol

Parameter

Min.

Max.

Unit

High-Side Floating Supply Voltage

V

High-Side Floating Supply Offset Voltage

600

V

High-Side Output Voltage

V

Low-Side and Logic Supply Voltage

10

20

V

Low-Side Output Voltage

COM

V

Logic Input Voltage (HIN and LIN)

V

Operating Ambient Temperature

-40

+125

C