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ICX081AK Datasheet(PDF) 1 Page - Sony Corporation

Part No. ICX081AK
Description  Diagonal 6mm (Type 1/3) CCD Image Sensor for PAL Color Video Cameras
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Maker  SONY [Sony Corporation]
Homepage  http://www.sony.co.jp
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ICX081AK Datasheet(HTML) 1 Page - Sony Corporation

 
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ICX081AK
E95703D99
Diagonal 6mm (Type 1/3) CCD Image Sensor for PAL Color Video Cameras
Description
The ICX081AK is an interline CCD solid-state
image sensor suitable for PAL color video cameras.
This chip conforms to DV standard SD mode, and
has the optimal number of pixels for MPEG2 Main
level. While achieving a horizontal resolution of 450
TV lines, the area has been expanded 33% in both
vertical and horizontal directions, making the chip
suitable
for
electronic
vibration
stabilizer
and
electronic panning/tilting. In addition, complete 16:9
wide aspect ratio images are provided with a high
picture quality without requiring vertical interpolation.
High sensitivity and low dark current are achieved
through the adoption of Ye, Cy, Mg and G
complementary color mosaic filters and HAD (Hole-
Accumulation Diode) sensors.
This chip features a field period readout system
and an electronic shutter with variable charge-
storage time.
The package is a 16-pin DIP (Plastic), and both
top and bottom surface reference can be assured at
the same time.
Features
• Supports electronic vibration stabilizer and electronic panning/tilting
(33%/one side)
• Supports electronic zoom
• Supports DV standard SD mode and MPEG2 Main level (13.5MHz)
• Supports 16:9 wide aspect ratio (for both 18MHz and 4fsc)
• Supply voltage: 12V
• Horizontal register and reset gate: 2.7 to 3.6V drive
• No voltage adjustment (Reset gate and substrate bias are not adjusted.)
• High resolution, high sensitivity, low dark current and low smear
• Excellent antiblooming characteristics
• Continuous variable-speed shutter (1/50 to 1/10000s)
• Supports short exit pupil distance (Recommended range: –20 to –100mm)
• Ye, Cy, Mg and G complementary color mosaic filters on chip
• 16-pin high precision plastic package (both top and bottom surface reference possible)
Device Structure
• Interline CCD image sensor
• Image size:
Diagonal 6mm (Type 1/3)
• Total number of pixels:
1016 (H) x 794 (V)
approx. 810K pixels
• Total number of effective pixels:
962 (H) x 774 (V)
approx. 740K pixels
• Number of effective pixels: 4:3 PAL:
702 (H) x 575 (V)
approx. 400K pixels
16:9 18MHz:
936 (H) x 575 (V)
approx. 540K pixels
16:9 4fsc:
922 (H) x 575 (V)
approx. 530K pixels
• Chip size:
5.90mm (H) x 4.92mm (V)
• Unit cell size:
5.15µm (H) x 4.70µm (V)
• Optical black:
Horizontal (H) direction: Front 4 pixels, rear 50 pixels
Vertical (V) direction:
Front 12 pixels, rear 8 pixels
• Number of dummy bits:
Horizontal 28
Vertical 1 (even fields only)
• Substrate material:
Silicon
Sony reserves the right to change products and specifications without prior notice. This information does not convey any license by
any implication or otherwise under any patents or other right. Application circuits shown, if any, are typical examples illustrating the
operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits.
16 pin DIP (Plastic)
Pin 1
V
4
50
8
12
Pin 9
H
Optical black position
(Top View)


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