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FOD8316R2V Datasheet(PDF) 5 Page - Fairchild Semiconductor

Part # FOD8316R2V
Description  2.5A Output Current, IGBT Drive Optocoupler
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Manufacturer  FAIRCHILD [Fairchild Semiconductor]
Direct Link  http://www.fairchildsemi.com
Logo FAIRCHILD - Fairchild Semiconductor

FOD8316R2V Datasheet(HTML) 5 Page - Fairchild Semiconductor

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©2010 Fairchild Semiconductor Corporation
www.fairchildsemi.com
FOD8316 Rev. 1.2.0
5
Absolute Maximum Ratings (T
A = 25ºC unless otherwise specified)
Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be
operable above the recommended operating conditions and stressing the parts to these levels is not recommended.
In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability.
The absolute maximum ratings are stress ratings only.
Notes:
1. Maximum pulse width = 10µs, maximum duty cycle = 0.2%.
2. This negative output supply voltage is optional. It’s only needed when negative gate drive is implemented. Refer to
“Dual Supply Operation – Negative Bias at Vss” on page 23.
3. No derating required across temperature range.
4. Derate linearly above 64°C, free air temperature at a rate of 10.2mW/°C
5. Functional operation under these conditions is not implied. Permanent damage may occur if the device is subjected
to conditions outside these ratings.
Recommended Operating Conditions
The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended
operating conditions are specified to ensure optimal performance to the datasheet specifications. Fairchild does not
recommend exceeding them or designing to absolute maximum ratings.
Note:
6. During power up or down, it is important to ensure that VIN+ remains low until both the input and output supply
voltages reaches the proper recommended operating voltages to avoid any momentary instability at the output state.
See also the discussion in the “Time to Good Power” section on page 23.
Symbol
Parameter
Value
Units
TSTG
Storage Temperature
-40 to +125
ºC
TOPR
Operating Temperature
-40 to +100
ºC
TJ
Junction Temperature
-40 to +125
ºC
TSOL
Lead Wave Solder Temperature
(no solder immersion)
Refer to page 27 for reflow temperature profile.
260 for 10 sec
ºC
IFAULT
Fault Output Current
15
mA
IO(PEAK)
Peak Output Current(1)
3A
VE – VSS
Negative Output Supply Voltage(2)
0 to 15
V
VDD2 – VE
Positive Output Supply Voltage
-0.5 to 35 – (VE – VSS)V
VO(peak)
Gate Drive Output Voltage
-0.5 to 35
V
VDD2 – VSS
Output Supply Voltage
-0.5 to 35
V
VDD1
Positive Input Supply Voltage
-0.5 to 6
V
VIN+, VIN- and VRESET
Input Voltages
-0.5 to VDD1
V
VFAULT
Fault Pin Voltage
-0.5 to VDD1
V
VS
Source of Pull-up PMOS Transistor Voltage
VSS + 6.5 to VDD2
V
VDESAT
DESAT Voltage
VE to VE + 11
V
PDI
Input Power Dissipation(3)(5)
100
mW
PDO
Output Power Dissipation(4)(5)
600
mW
Symbol
Parameter
Min.
Max.
Unit
TA
Ambient Operating Temperature
-40
+100
ºC
VDD1
Input Supply Voltage(6)
3
5.5
V
VDD2 – VSS
Total Output Supply Voltage
15
30
V
VE – VSS
Negative Output Supply Voltage
0
15
V
VDD2 – VE
Positive Output Supply Voltage(6)
15
30 – (VE – VSS)V
VS
Source of Pull-up PMOS Transistor Voltage
VSS + 7.5
VDD2
V


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