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MAX16955 Datasheet(PDF) 2 Page - Maxim Integrated Products

Part # MAX16955
Description  36V, 1MHz Step-Down Controller with Low Operating Current
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Manufacturer  MAXIM [Maxim Integrated Products]
Direct Link  https://www.maximintegrated.com/en.html
Logo MAXIM - Maxim Integrated Products

MAX16955 Datasheet(HTML) 2 Page - Maxim Integrated Products

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MAX16955
36V, 1MHz Step-Down Controller
with Low Operating Current
2
Maxim Integrated
ABSOLUTE MAXIMUM RATINGS
ELECTRICAL CHARACTERISTICS
(VSUP = VEN = 14V, CIN = 10µF, COUT = 94µF, CBIAS = 2.2µF, CBST = 0.1µF, RFOSC = 76.8kΩ, TA = TJ = -40°C to +125°C, unless
otherwise noted. Typical values are at TA = +25°C.) (Note 2)
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer
board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial.
SUP and EN to SGND ............................................-0.3V to +42V
LX to PGND ..............................................................-1V to +42V
BST to LX .................................................................-0.3V to +6V
BIAS, FB, PGOOD, FSYNC to SGND .......................-0.3V to +6V
DH to LX ...................................................................-0.3V to +6V
DL to PGND .............................................-0.3V to (VBIAS + 0.3V)
FOSC to SGND ........................................-0.3V to (VBIAS + 0.3V)
CS and OUT to SGND ............................................-0.3V to +11V
PGND to SGND .....................................................-0.3V to +0.3V
Continuous Power Dissipation (TA = +70°C)
TSSOP (derate 26.1mW/°C above +70°C) .............2088.8mW*
Operating Temperature Range .........................-40°C to +125°C
Junction Temperature ......................................................+150°C
Storage Temperature Range .............................-65°C to +150°C
Lead Temperature (soldering, 10s) .................................+300°C
Soldering Temperature (reflow) .......................................+260°C
PACKAGE THERMAL CHARACTERISTICS (Note 1)
TSSOP
Junction-to-Ambient Thermal Resistance (
θJA) .........38.3°C/W
Junction-to-Case Thermal Resistance (
θJC) ...................3°C/W
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
SUP Input Voltage Range
VSUP
(Note 3)
3.5
36
V
SUP Operating Supply Current
ISUP
Fixed 5V output, fixed-frequency, PWM
mode, VFB = VBIAS, no external FETs
connected
1
mA
Skip Mode Supply Current
ISKIP
No load, fixed 5V output
50
90
µA
SUP Shutdown Supply Current
ISHDN,SUP
VEN = 0V
10
20
µA
VSUP = 3.5V, IBIAS = 45mA
3.0
BIAS Voltage
VBIAS
6V < VSUP < 36V
4.7
5.0
5.3
V
BIAS Undervoltage Lockout
VUVBIAS
VBIAS rising
3.1
3.4
V
BIAS Undervoltage Lockout
Hysteresis
VBIAS falling
200
mV
BIAS Minimum Load
IBIAS(MIN)
VSUP - VBIAS > 200mV
45
mA
OUTPUT VOLTAGE (OUT)
Output Voltage Adjustable
Range
1.0
10
V
OUT Pulldown Resistance
RPULL_D
VEN = 0V or fault condition active
30
Output Voltage (5V Fixed Mode)
VOUT
VSUP = 6V to 36V, VFB = VBIAS, fixed-
frequency mode (Note 4)
4.925
5.0
5.075
V
FB Feedback Voltage
(Adjustable Mode)
VFB
VSUP = 6V to 36V, 0V < (VCS - VOUT)
< 80mV, fixed-frequency mode
0.99
1.0
1.01
V
FB Current
IFB
VFB = 1.0V
0.02
µA
*
As per JEDEC51 standard (multilayer board).


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