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MAX16955 Datasheet(PDF) 2 Page - Maxim Integrated Products |
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MAX16955 Datasheet(HTML) 2 Page - Maxim Integrated Products |
2 / 26 page MAX16955 36V, 1MHz Step-Down Controller with Low Operating Current 2 Maxim Integrated ABSOLUTE MAXIMUM RATINGS ELECTRICAL CHARACTERISTICS (VSUP = VEN = 14V, CIN = 10µF, COUT = 94µF, CBIAS = 2.2µF, CBST = 0.1µF, RFOSC = 76.8kΩ, TA = TJ = -40°C to +125°C, unless otherwise noted. Typical values are at TA = +25°C.) (Note 2) Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial. SUP and EN to SGND ............................................-0.3V to +42V LX to PGND ..............................................................-1V to +42V BST to LX .................................................................-0.3V to +6V BIAS, FB, PGOOD, FSYNC to SGND .......................-0.3V to +6V DH to LX ...................................................................-0.3V to +6V DL to PGND .............................................-0.3V to (VBIAS + 0.3V) FOSC to SGND ........................................-0.3V to (VBIAS + 0.3V) CS and OUT to SGND ............................................-0.3V to +11V PGND to SGND .....................................................-0.3V to +0.3V Continuous Power Dissipation (TA = +70°C) TSSOP (derate 26.1mW/°C above +70°C) .............2088.8mW* Operating Temperature Range .........................-40°C to +125°C Junction Temperature ......................................................+150°C Storage Temperature Range .............................-65°C to +150°C Lead Temperature (soldering, 10s) .................................+300°C Soldering Temperature (reflow) .......................................+260°C PACKAGE THERMAL CHARACTERISTICS (Note 1) TSSOP Junction-to-Ambient Thermal Resistance ( θJA) .........38.3°C/W Junction-to-Case Thermal Resistance ( θJC) ...................3°C/W PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS SUP Input Voltage Range VSUP (Note 3) 3.5 36 V SUP Operating Supply Current ISUP Fixed 5V output, fixed-frequency, PWM mode, VFB = VBIAS, no external FETs connected 1 mA Skip Mode Supply Current ISKIP No load, fixed 5V output 50 90 µA SUP Shutdown Supply Current ISHDN,SUP VEN = 0V 10 20 µA VSUP = 3.5V, IBIAS = 45mA 3.0 BIAS Voltage VBIAS 6V < VSUP < 36V 4.7 5.0 5.3 V BIAS Undervoltage Lockout VUVBIAS VBIAS rising 3.1 3.4 V BIAS Undervoltage Lockout Hysteresis VBIAS falling 200 mV BIAS Minimum Load IBIAS(MIN) VSUP - VBIAS > 200mV 45 mA OUTPUT VOLTAGE (OUT) Output Voltage Adjustable Range 1.0 10 V OUT Pulldown Resistance RPULL_D VEN = 0V or fault condition active 30 Output Voltage (5V Fixed Mode) VOUT VSUP = 6V to 36V, VFB = VBIAS, fixed- frequency mode (Note 4) 4.925 5.0 5.075 V FB Feedback Voltage (Adjustable Mode) VFB VSUP = 6V to 36V, 0V < (VCS - VOUT) < 80mV, fixed-frequency mode 0.99 1.0 1.01 V FB Current IFB VFB = 1.0V 0.02 µA * As per JEDEC51 standard (multilayer board). |
Similar Part No. - MAX16955_12 |
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Similar Description - MAX16955_12 |
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