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MAX5801 Datasheet(PDF) 2 Page - Maxim Integrated Products |
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MAX5801 Datasheet(HTML) 2 Page - Maxim Integrated Products |
2 / 31 page 2 Maxim Integrated MAX5800/MAX5801/MAX5802 Ultra-Small, Dual-Channel, 8-/10-/12-Bit Buffered Output DACs with Internal Reference and I2C Interface VDD, VDDIO to GND ................................................ -0.3V to +6V OUT_, REF to GND .................................... -0.3V to the lower of (VDD + 0.3V) and +6V SCL, SDA, CLR to GND .......................................... -0.3V to +6V ADDR to GND .............................................-0.3V to the lower of (VDDIO + 0.3V) and +6V Continuous Power Dissipation (TA = +70NC) µMAX (derate at 8.8mW/NC above 70NC)....................707mW TDFN (derate at 24.4mW/NC above 70NC) ................1951mW Maximum Continuous Current into Any Pin .................... Q50mA Operating Temperature Range........................ -40NC to +125NC Storage Temperature Range............................ -65NC to +150NC Lead Temperature (soldering, 10s) ................................+300NC Soldering Temperature (reflow) .................................... +260NC µMAX Junction-to-Ambient Thermal Resistance (θJA) .......113NC/W Junction-to-Case Thermal Resistance (θJC) ..............42NC/W TDFN Junction-to-Ambient Thermal Resistance (θJA) ..........41NC/W Junction-to-Case Thermal Resistance (θJC) ................9NC/W ABSOLUTE MAXIMUM RATINGS Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial. Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional opera- tion of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. PACKAGE THERMAL CHARACTERISTICS (Note 1) ELECTRICAL CHARACTERISTICS (VDD = 2.7V to 5.5V, VDDIO = 1.8V to 5.5V, VGND = 0V, CL = 200pF, RL = 2kI, TA = -40NC to +125NC, unless otherwise noted. Typical values are at TA = +25NC.) (Note 2) PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS DC PERFORMANCE (Note 3) Resolution and Monotonicity N MAX5800 8 Bits MAX5801 10 MAX5802 12 Integral Nonlinearity (Note 4) INL MAX5800 -0.25 Q 0.05 +0.25 LSB MAX5801 -0.5 Q 0.25 +0.5 MAX5802 -1 Q 0. 5 +1 Differential Nonlinearity (Note 4) DNL MAX5800 -0.25 Q 0.05 +0.25 LSB MAX5801 -0.5 Q 0.1 +0.5 MAX5802 -1 Q 0.2 +1 Offset Error (Note 5) OE -5 Q 0.5 +5 mV Offset Error Drift Q 10 F V/NC Gain Error (Note 5) GE -1.0 Q 0.1 +1.0 %FS Gain Temperature Coefficient With respect to VREF Q 3.0 ppm of FS/NC Zero-Scale Error 0 10 mV Full-Scale Error With respect to VREF -0.5 +0.5 %FS |
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