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SF2159E Datasheet(PDF) 5 Page - RF Monolithics, Inc |
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SF2159E Datasheet(HTML) 5 Page - RF Monolithics, Inc |
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5 / 6 page  www.RFM.com E-mail: info@rfm.com Page 5 of 6 ©2009-2010 by RF Monolithics, Inc. SF2159E - 7/19/10 A 1 2 3 B 7 6 5 4 C H 4 E F G 8 D 8 7 6 5 1 2 3 I I J J J K K L M N N O O 8-Terminal Ceramic Surface-Mount Case 3.0 X 3.0 mm Nominal Footprint TOP VIEW BOTTOM VIEW PCB Footprint Top View Case Materials Materials Solder Pad Plating 0.3 to 1.0 µm Gold over 1.27 to 8.89 µm Nickel Lid Plating 2.0 to 3.0 µm Nickel Body Al2O3 Ceramic Pb Free Dimension mm Inches Min Nom Max Min Nom Max A 2.87 3.0 3.13 0.113 0.118 0.123 B 2.87 3.0 3.13 0.113 0.118 0.123 C 1.14 1.27 1.40 0.045 0.050 0.055 D 0.79 0.92 1.05 0.031 0.036 0.041 E 0.62 0.75 0.88 0.024 0.029 0.034 F 0.47 0.60 0.73 0.018 0.024 0.029 G 0.47 0.60 0.73 0.018 0.024 0.029 H 1.07 1.20 1.33 0.042 0.047 0.052 I 3.19 0.126 J 0.81 0.032 K 0.96 0.038 L 0.81 0.032 M 1.39 0.055 N 0.23 0.009 O 0.38 0.015 Case and PCB Footprint Dimensions |
Similar Part No. - SF2159E |
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Similar Description - SF2159E |
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